Array signal processing

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A Multiply-and-Accumulate SAR-ADC-Based Hybrid Slepian Beamformer

A Multiply-and-Accumulate SAR-ADC-Based Hybrid Slepian Beamformer 150 150
Author(s): Zhengqi Xu, Zhiyuan Zhao, Michael A. Laun, Coleman DeLude, Justin Romberg, Michael P. Flynn

Abstract:

This article introduces a hybrid Slepian beamforming receiver architecture with low power and area costs. Traditional large-scale true-time-delay (TTD) beamformers for wideband wireless communication suffer from high power consumption and high hardware costs. As an alternative, the Slepian beamforming approach reduces the number of analog-to-digital conversions (ADCs) and delays for …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651452
Publisher: IEEE

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A 10.9nV/√Hz, 74.9dB-DR, 20MS/s Ultrasound Analog Front End for Fully-Digital Beamforming

A 10.9nV/√Hz, 74.9dB-DR, 20MS/s Ultrasound Analog Front End for Fully-Digital Beamforming 150 150
Author(s): Changde Ding, Yan Zhu, Pengjie Wang, Zhiliang Hong, Jiawei Xu

Abstract:

This letter presents a compact and energy-efficient analog front-end (AFE) circuit for fully-digital beamforming in endoscopic and catheter-based 3D-ultrasound imaging. The AFE converts single-ended analog input from each transducer element into a 10-bit digital output through a low-noise amplifier (LNA) and a 20 MS/s SAR ADC. To minimize chip area …

Published in: IEEE Solid-State Circuits Letters
Page(s): 1 – 1
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3581584
Publisher: IEEE

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Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields

Two 7–13-GHz GaAs-SiGe Four–Channel Beamforming Chiplets With/Without Metallic Interlayer Shields 150 150
Author(s): Nengxu Zhu, Yiting Zhang, Genyin Ma, Fanyi Meng

Abstract:

This letter presents two 7–13-GHz GaAs-SiGe four-channel beamforming chiplets to minimize the chip area. The chips integrate GaAs-based power amplifiers (PAs) and low-noise amplifiers (LNAs) with silicon-based phase and amplitude control modules using gold bumps. To mitigate coupling between the metal patterns of the heterogeneous chips and avoid interference with …

Published in: IEEE Solid-State Circuits Letters
Page(s): 161 – 164
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3573757
Publisher: IEEE

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