Aging

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A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms

A Modular Ring-Oscillator Array Chip for Accurate Stress Testing of CMOS Aging Mechanisms 150 150
Author(s): Javier Diaz-Fortuny, Erik Bury, Robin Degraeve, Ben Kaczer

Abstract:

Ring-oscillator (RO) circuits have historically been used to characterize the performance of CMOS technologies, as they can easily expose both process variability and aging through a straightforward circuit structure. ROs are widely employed to study degradation mechanisms such as bias temperature instability (BTI) and hot carrier degradation (HCD), which progressively …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3653472
Publisher: IEEE

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A Compact, Highly-Digital Sensor-Fusion-Based Joint V dd-Temperature Sensor for SoC Thermal Management

A Compact, Highly-Digital Sensor-Fusion-Based Joint V dd-Temperature Sensor for SoC Thermal Management 150 150
Author(s): Hikmet Seha Öztürk, Julian Arenas, Carlos Tokunaga, Nasser Kurd, Visvesh S. Sathe

Abstract:

This article presents a fine-grained thermal sensing network for thermal management in SoCs. Sensor nodes in this network are made up of joint supply voltage ( $V_{\mathrm {dd}}$ ) and temperature ( $T$ ) sensors, which are compact and highly digital. Measurements from these simple but imperfect sensors are jointly processed to extract …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3621280
Publisher: IEEE

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CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability

CFET Beyond 3 nm: SRAM Reliability Under Design-Time and Run-Time Variability 150 150
Author(s): Sufia Shahin, Swati Deshwal, Anirban Kar, Mahdi Benkhelifa, Yogesh S. Chauhan, Hussam Amrouch

Abstract:

This work investigates the reliability of complementary field-effect transistors (CFETs) by addressing both design-time variability arising from process variations and run-time variability due to temperature and aging effects. A rigorously calibrated TCAD model, validated against experimental CFET data, is employed to quantify the impact of metal gate granularity (MGG)-induced …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 51 – 59
Year of Publication: 2025
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2025.3568622
Publisher: IEEE

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