advanced packaging

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A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET

A 0.29 pJ/b 5.27 Tb/s/mm UCIe Advanced Package Link With 2.5-D CoWoS Interposer and a 0.52 pJ/b 0.448 Tb/s/mm UCIe Standard Package Link With Organic Substrate in 3 nm FinFET 150 150
Author(s): Didem Turker Melek, James Vandersand, R. Navin Kumar, Pyare M. Sarkar, Prakash BS, Adrian Leuciuc, Kevin Geary, Shaojun Ma, Chirag M. Mehta, Basant Bothra, Shashi Jain, Pawan Sabharwal, Ranjan Vaish, Kirti Bhanushali, Yutong Ding, Craig Frost, John Annunziata, Krishanu Sadhu, Dimitris Kyritsis, Jeff Bostak, Ming Li, Steve Williams, Ken Chang

Abstract:

This work presents two die-to-die (D2D) wireline transceivers, one compliant with the UCIe advanced package (UCIe-AP) and the other with the UCIe standard package (UCIe-SP) standard, developed in 3 nm FinFET. The Universal Chiplet interconnect express (UCIe)-AP link has 64 RX and 64 TX data lanes in one PHY module and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3651425
Publisher: IEEE

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A 32 Gb/s 0.36 pJ/bit 3 nm Chiplet IO Using 2.5-D CoWoS Package With Real-Time and Per-Lane CDR and Bathtub Monitoring

A 32 Gb/s 0.36 pJ/bit 3 nm Chiplet IO Using 2.5-D CoWoS Package With Real-Time and Per-Lane CDR and Bathtub Monitoring 150 150
Author(s): Junhui Gu, John Ma, Azhar Ahmed Chowdhury, Jianmin Guo, Xin Zhang, Jackson Ding, Hui Wang, Ken Chang

Abstract:

This article presents a high-density, single-ended non return to zero (NRZ) chiplet I/O implemented with 3 nm CMOS technology on a 2.5-D chip-on-wafer-on-substrate (CoWoS) interposer, accommodating trace lengths up to 2 mm. The design features 216 data lanes, each operating at 32 Gb/s. For the tested 2-mm trace, the channel insertion loss …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1289 – 1298
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3545483
Publisher: IEEE

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