3D integration

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A Hybrid-Bonded 12.1 TOPS/mm2 56-Core DNN Processor With 2.5 Tb/s/mm2 3D Network on Chip in Intel 18A and Intel 3

A Hybrid-Bonded 12.1 TOPS/mm2 56-Core DNN Processor With 2.5 Tb/s/mm2 3D Network on Chip in Intel 18A and Intel 3 150 150
Author(s): Phil C. Knag, Gregory K. Chen, Shanshan Xie, Satish Yada, Wei Wu, Yu-Shiang Lin, Alexander Kashirin, Xiemei Meng, Russell Criss, Ana Sonia Leon, Carlos Tokunaga, Ram K. Krishnamurthy, James W. Tschanz

Abstract:

This article presents a modular 3D stacked manycore processor that integrates a general-purpose RISC-V base die with a domain-specific deep neural network (DNN) accelerator die using a 9 $\mu $ m hybrid-bonded interconnect (HBI). A custom $14 \times 4~\times 2$ 3D network-on-chip (3D NoC) provides a flat, distributed shared-memory address space across 112 tiles, enabling …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3735250
Publisher: IEEE

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3D-Integrated Near-Sensor AI for Energy-Constrained Environmental Monitoring Systems

3D-Integrated Near-Sensor AI for Energy-Constrained Environmental Monitoring Systems 150 150
Author(s): Arya Upadhyay

Abstract:

Moving sensor data and neural-network operands through conventional external-memory hierarchies can constitute a substantial fraction of the energy required for edge inference. Motivated by a three-tier near-sensor organization, this work evaluates memory localization using a controlled architecture-level study and an independent transistor-level communication-link analysis. Five convolution configurations are evaluated on …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3735890
Publisher: IEEE

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