Vertical cavity surface emitting lasers

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Dual-Junction Monolithically Integrated Monitoring Photodiode With a Two-Stage 18 GHz 18 pA/√Hz TIA in 22-nm FDSOI

Dual-Junction Monolithically Integrated Monitoring Photodiode With a Two-Stage 18 GHz 18 pA/√Hz TIA in 22-nm FDSOI 150 150
Author(s): Jelle H. T. Bakker, Nimit Jain, Paul Klatser, Mark S. Oude Alink, Bram Nauta

Abstract:

We present a monolithically integrated (MI) dualjunction monitoring photodiode (PD) and transimpedance amplifier (TIA). The photocurrent originates from the deep Nwell (DNW)/P-type substrate (PSUB) $({\lt }5~ \mathrm {GHz})$ and the P-Well $(\mathrm {PW}) / \mathrm {DNW}({\gt }1~ \mathrm {GHz})$ junctions. The presented combination of bulk PD and 22 nm fully-depleted silicon-on-insulator (FDSOI) …

Published in: IEEE Solid-State Circuits Letters
Page(s): 313 – 316
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3615656
Publisher: IEEE

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A 4 × 50 Gb/s 2.9-pJ/b NRZ VCSEL-Based Co-Packaged Optical Link With Fiber Termination

A 4 × 50 Gb/s 2.9-pJ/b NRZ VCSEL-Based Co-Packaged Optical Link With Fiber Termination 150 150
Author(s): Sashank Krishnamurthy, Susnata Mondal, Junyi Qiu, Joseph Kennedy, Soumya Bose, Tolga Acikalin, Shuhei Yamada, James Jaussi, Mozhgan Mansuri

Abstract:

A four-channel vertical cavity surface-emitting laser (VCSEL)-based co-packaged optical (CPO) transceiver (TRX) is demonstrated, integrating a photodiode (PD) array, a trans-impedance amplifier front-end integrated circuit (TIA-FE IC), an electrical receiver (RX) IC, and optical fiber termination on a single package on the receive side. The transmitter (TX) counterpart incorporates …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 16
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3600662
Publisher: IEEE

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