IEEE conference organizers are critical to the planning and implementation of more than 1,100 high-quality technical conferences each year. Conference organizers serve a variety of roles within their conference committee and may hold other positions within their section, chapter or society.

If you are a member of IEEE and are interested in becoming an IEEE Conference Organizer, here are some steps to get started:

• Contact your IEEE society/council and IEEE region/section/chapter
• Use the checklist and timeline for planning an IEEE conference
• Learn about the annual Panel of Conference Organizers (POCO)
• Browse back issues of the Conference Organizers' Newsletter

In addition, please take the time to review the following:

• Conference Application
• Conference Financial Management and Reporting
• Technical Program
• Conference Publications
• Registration
• Panel of Conference Organizers (POCO)
• Conference Organizers Manual
• Required Documentation
• Additional Resources
• Services

Applying for SSCS Technical Cosponsorship

A Message for Conference Organizers

When SSCS provides technical co-sponsorship, your conference can

1. Run your Call for Papers in the JSSC
2. Run publicity articles about the conference in the quarterly Solid-State Circuits Magazine
3. Be listed in the SSCS conference calendar
4. Use the SSCS logo on your web page, advance program, proceedings or any other conference publicity or publications.

To Request SSCS Sponsorship

The process for approval requires that the conference actually apply for approval with the SSCS Meetings Committee at one of the regular meetings in February or August. This approval should occur approximately 18 months prior to the actual conference. The key items required for the review can be made at a short presentation at either of the meetings. Specific things which should be provided to the Meetings Chair prior to the Meetings Committee meeting include:

1. Who will be presenting to the committee?
2. What is the focus of proposed conference? Are there other sponsoring organizations, especially funding sponsor?
3. For which year are you requesting approval?
4. What are the dates and location of the conference?
5. Statistical details including:
   

   What is the attendance?
   How many papers were submitted?
   How many papers were accepted? (Invited and contributed)
   What is the geographic distribution of submissions/acceptances?
   Are the Proceedings available on IEEEXplore?

6. Any other information that you consider important in evaluating the proposed conference and the value of SSCS co-sponsorship.
7. Please bring a copy of the most recent proceedings to the meeting.

Though not precluded, it is not often that a first time conference receives technical co-sponsorship. Please contact Alessandro Piovaccari, Meetings Committee Chairman for further assistance in preparation or scheduling.

Using Technical Cosponsorship 

Utilize SSCS to Publicize your Technical Cosponsored Conference

Once SSCS has agreed to be a technical co-sponsor of a conference, here's how Conference Organizers can utilize the benefits of that approval.

1. Run your Call for Papers (CFP) in the JSSC

• Send a ONE page 18 x 23.7 cm formatted in Microsoft Word to Danielle Marinese. Please format the CFP as one page filler for the Journal. Calls For Papers originally laid out as a postal mailing almost always will require the conference to reformat for use in the JSSC. A CFP is run as space is available and we cannot guarantee your CFP will be included in any issue-month.
• The CFP must arrive one full month before the target issue 

2. Run publicity articles about the conference in the quarterly Solid-State Circuits Magazine

• Send articles no longer than 700 words with illustrations to Danielle Marinese (d.marinese@ieee.org) 

3. Be listed in the SSCS conference calendar

• SSCS publicity list is based on the IEEE Conference Information Schedule. The conference organizer should complete this web-based entry form as early as the date, location, one contact person and one approved sponsor are known.
• Your conference will be listed on SSCS Conferences home page, as soon as the Conference Information Schedule is filled out. Check before you start a form in case the conference is already listed. To add missing information or correct it;
  • send email to IEEE Conference Services,
  • in the subject field use the IEEE unique Conference Code Number listed on the SSCS Conferences home page.
  • in the email message indicate the new information you want added e.g. the deadline for paper or abstract information or new meeting dates or location.

4. If your financial sponsor has not started anMOUwith SSCS, please begin the process using currently approved IEEE templates.

5. Use the SSCS logo on your web page, advance program, proceedings or any other conference publicity or publications.

• Be careful not to distort the aspect ratio as designed in the original file. Download logos here. 

6. Order postal address mail lists for your use. You may ask the IEEE conference services to mail your brochures with special US discount rates for non-profits. Since these mailings may take longer, they will require longer lead times and advance planning. To take advantage of Society publications as platforms for publicizing your conference, please plan your publicity in advance. 

Organizer's Tracking Tool

The IEEE International Solid-State Circuits Conference (ISSCC) 2017 Call for Papers is now posted online at http://submissions.mirasmart.com/ISSCC2017/PDF/ISSCC2017CFP.pdf.  ISSCC 2017 will be held Sunday-Thursday, February 5-9, 2017 at the San Francisco Marriott Marquis in San Francisco, CA.  ISSCC is the flagship conference of the Solid-State Circuits Society, and is the premier forum for the presentation of advances in solid-state circuits and systems-on-a-chip.

The ISSCC 2017 conference theme is “Intelligent Chips for a Smart World”. Advancements in solid-state circuits and systems continue to propel the ongoing fusion between the physical and virtual worlds. With the resulting growth in sensor deployment, data traffic and data center workloads, future systems must employ “intelligent” chips at all levels of the system stack to improve the efficiency at which we acquire, network, store, and process information. Modern applications centered around the Internet of Everything (IoE) and real-time data analytics are driving circuit and system designers toward new ways of leveraging the immense device density and processing power of modern technology. The ISSCC 2017 is seeking innovations that will fuel further progress in this development toward a truly smart and interconnected world.

Innovative and original papers are solicited in subject areas including (but not limited to) Analog, Data Converters, Digital Circuits, Digital Architectures & Systems, Imagers, MEMS, Medical & Display, Memory, RF, Technology Directions, Wireless and Wireline.

The Submission Deadline is Monday, September 12, 2016 at 3:00PM Eastern Daylight Time (19:00 GMT).

ISSCC regularly features more than 200 technical presentations representing benchmark results, designs in state-of-the-art processes, and circuits in emerging device technologies. It also features a variety of educational events, and evening sessions. It highlights systems aspects of regular-paper presentations with Demonstration Sessions.

Graduate students are invited to participate in opportunities to showcase ongoing work and exchange experiences with other students and researchers from academia and industry. These include the Student Research Preview and the Silkroad Award (to a first-time student presenting author of a regular paper from an emerging region in the Far East).

New for ISSCC 2017: Double-Blind Paper Review

The paper selection for ISSCC 2017 will follow a double-blind review process, meaning that both the authors and reviewers will remain anonymous during the paper selection process. All authors must adhere to the following guidelines to conceal their identity: (1) Eliminate names, contact information, and affiliations from the entire manuscript (including PDF metadata, logos on die photos, logos on printed circuit board photos, etc.). (2) Cite all relevant prior work (including your own) in the third person (for example, "It has been shown that… [1]"; do not use the words "my" or "our"). Submitted (unpublished) work that is substantially related to the submission must also be cited, but in an anonymized format. Do not cite patents. (3) Eliminate acknowledgments and references to funding sources. (4) Do not contact the program committee members to solicit input on your manuscript. The identity of authors is known to the program chair/vice-chair and the subcommittee chairs; you may contact them for questions. Manuscripts that are not properly anonymized cannot be considered for review. The review process will include a software-based plagiarism check. After paper selection, a final pre-publication check using the authors’ names is applied (see ISSCC Website for full details). The ISSCC may withdraw any selected paper that violates the pre-publication guidelines. For further details, see the ISSCC Website (sample manuscript, detailed instructions and FAQ on double-blind review).