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Special Evening Event on IC Connectivity (ISSCC 2023)

Date
2023-02-20
Location
ISSCC 2023 - San Francisco Marriott Marquis
Region
IEEE Region 6 (Western USA)
Contact
Aeisha VanBuskirk – a.vanbuskirk@ieee.org
Sponsorship
Sponsor
Description

Data-centric applications such as automotive, IoT, and machine learning primarily depend on IC connectivity to meet the demands of high-bandwidth and energy-efficient communication. Product requirement diversity continues to grow and IC components now face a bottleneck in system performance and power, particularly due to their interconnects. To ensure communication capabilities that meet the demands of emerging applications with ever-increasing features, additional research and focus is needed. This panel focuses on connectivity for the next generation of communication systems and brings together expert panelists to share their perspectives on topics in IC connectivity across wireless, wireline, chip-to-chip, and optical link communications.


Speakers will present opening statements, which will be followed by a moderated panel on contentious issues being faced in the field of IC connectivity.

 

Moderator: Maryam Rofougaran, Movandi

Kyeongha Kwon, KAIST

Anghad Rekhi, NVIDIA 

Asako Toda,
Intel

Hua Wang,
ETH Zurich

WIRELINE

OPTICAL

WIRELINE

WIRELESS