Inductors

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Design and Analysis of a 13.7–41 GHz Ultra-Wideband Frequency Doubler With Cross-Coupled Push-Push Structure

Design and Analysis of a 13.7–41 GHz Ultra-Wideband Frequency Doubler With Cross-Coupled Push-Push Structure 150 150
Author(s): Kai Li, Keping Wang, Fanyi Meng, Kiat Seng Yeo, Kaixue Ma

Abstract:

This article presents a 13.7–41 GHz ultra-wideband frequency doubler with high efficiency and conversion gain (CG). The proposed cross-coupled push-push structure, in conjunction with the fourth-order transformer-based resonator and the series gate inductor, collaboratively shapes the input signal amplitude such that three distinct peaks emerge at different frequencies, thereby significantly improving …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3667289
Publisher: IEEE

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1–1.7-GHz Single-Voltage-Controlled Tunable MMIC BPF With Over 45-dB Rejection to 30 GHz Using Tapped Inductor Technique

1–1.7-GHz Single-Voltage-Controlled Tunable MMIC BPF With Over 45-dB Rejection to 30 GHz Using Tapped Inductor Technique 150 150
Author(s): Di Lu, Menghan Sun, Baoqi Zhu, Xin Jiang, Ming Yu

Abstract:

This article presents a novel fourth-order single-voltage-controlled (SVC) tunable monolithic microwave integrated circuit (MMIC) bandpass filter (BPF) for tunable filter bank applications. Utilizing the tapped inductor technique (TIT), the proposed filter achieves compact magnetic coupling with reduced loss, avoiding the use of bulky inductor- or transformer-based coupling structures. The filter …

Published in: IEEE Solid-State Circuits Letters
Page(s): 105 – 108
Year of Publication: 2026
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2026.3668386
Publisher: IEEE

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A 4 × 224 Gb/s Single-Ended PAM-4 Transceiver Front-End With Noise Suppression Technique and Cascaded Equalizers in 130-nm SiGe BiCMOS

A 4 × 224 Gb/s Single-Ended PAM-4 Transceiver Front-End With Noise Suppression Technique and Cascaded Equalizers in 130-nm SiGe BiCMOS 150 150
Author(s): Xiongshi Luo, Xuewei You, Zhenghao Li, Hongzhi Wu, Yangyi Zhang, Fuzhan Chen, Xuxu Cheng, Wentao Zhou, Quan Pan

Abstract:

A dc-coupled analog single-ended (SE) transceiver (TRX) front-end supporting 224 Gb/s/lane is presented. It features SE-to-differential (S2D) and differential-to-SE (D2S) conversion, power-efficient broadband analog equalization, and noise suppression. Both the transmitter and receiver front-ends adopt pseudodifferential structures with dual-loop regulators to achieve a high power supply rejection …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3644437
Publisher: IEEE

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A Bi-Directional Dual-Path Boost–Buck Hybrid Converter for High-Voltage Power Transmission Delivery Cable in Humanoid Robots

A Bi-Directional Dual-Path Boost–Buck Hybrid Converter for High-Voltage Power Transmission Delivery Cable in Humanoid Robots 150 150
Author(s): Wenjie Yang, Zhiguo Tong, Junwei Huang, Rui P. Martins, Yan Lu

Abstract:

Humanoid robots have great potential to replace human labors for various tasks in the near future. For a centralized energy storage system in humanoid robots, its battery pack (heart) is located in the main body while the energy is mostly consumed through its legs and hands, demanding thick wires (strong …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3624037
Publisher: IEEE

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3D-IC Chiplet Integrated Power Supply With LDO, SCVR, and Buck DC–DC Converter

3D-IC Chiplet Integrated Power Supply With LDO, SCVR, and Buck DC–DC Converter 150 150
Author(s): Xiaosen Liu, Xichen Sun, Renwei Chen, Haozhe Zhang, Zhoutong Liu, Yan Wang

Abstract:

With the rapid advancement of chiplet and heterogenous integration technologies, delivering power through the package, redistribution layer (RDL), and chip layers in 3-D space has become a fundamental challenge for high-performance SoCs. This letter provides a comprehensive overview of power delivery solutions, including low-dropout regulator (LDOs), switched capacitor converters, and …

Published in: IEEE Solid-State Circuits Letters
Page(s): 341 – 344
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3624096
Publisher: IEEE

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A Zero-Voltage Switching Buck Converter With Enhanced Efficiency Over a Wide Load Range

A Zero-Voltage Switching Buck Converter With Enhanced Efficiency Over a Wide Load Range 150 150
Author(s): Jingyi Yuan, Qingqing Min, Siyang Liu, Lin Cheng

Abstract:

This article presents a wide-input-range buck converter featuring a conduction-loss-minimized zero-voltage switching (ZVS) technique. The proposed ZVS topology enables accurate ZVS operation across a wide range of input voltage ( $V_{\mathrm {IN}}$ ) and load current ( $I_{\mathrm {O}}$ ). By keeping the auxiliary inductor current pulse in the ZVS branch separate …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3609411
Publisher: IEEE

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A Two-Stage 12–1-V Converter Featuring Regulated Resonant SC Regulators and Collaborative Control Scheme

A Two-Stage 12–1-V Converter Featuring Regulated Resonant SC Regulators and Collaborative Control Scheme 150 150
Author(s): Shengdao Ren, Yukan Du, Menglian Zhao, Zhichao Tan, Chushan Li, Yong Ding, Wuhua Li, Wanyuan Qu

Abstract:

In the field of power converters for data centers, the two-stage architecture has received widespread attentions due to its various advantages. Especially, the switched-capacitor voltage regulator (SCVR) becomes popular as the second-stage converter owing to its high efficiency and power density. However, the SCVR suffers from poor voltage regulation and …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3609744
Publisher: IEEE

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A Low-EMI, High-DR Class-D Audio Amplifier With Double-Sided Voltage-Boosting Modulation

A Low-EMI, High-DR Class-D Audio Amplifier With Double-Sided Voltage-Boosting Modulation 150 150
Author(s): Jhuang-Wei Cyue, Tai-Haur Kuo

Abstract:

This article presents a digital-input class-D audio amplifier (CDA) that employs a double-sided voltage-boosting (DSVB) modulation scheme, integrating a capacitively coupled chopper amplifier (CCCA) with a single-inductor buck–boost power stage. The CCCA achieves a high dynamic range (DR) due to its very low noise floor and is implemented with …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3602261
Publisher: IEEE

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A 0-to- 10μF Off-Chip Output Capacitor-Scalable Boost Converter Achieving 96.68% Peak Efficiency

A 0-to- 10μF Off-Chip Output Capacitor-Scalable Boost Converter Achieving 96.68% Peak Efficiency 150 150
Author(s): Hyeon-Ji Choi, Joo-Mi Cho, Hyo-Jin Park, Seok-Jun Lee, Sung-Wan Hong

Abstract:

This letter presents an off-chip output capacitor (CO)-scalable (OCS) boost converter. The proposed OCS boost converter is possible to operate both with and without the off-chip CO. In addition, it operates in a whole conversion ratio (CR) range over 1 while maintaining a small current ripple of an inductor, resulting …

Published in: IEEE Solid-State Circuits Letters
Page(s): 233 – 236
Year of Publication: 2025
Electronic ISSN: 2573-9603
DOI: 10.1109/LSSC.2025.3594739
Publisher: IEEE

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