3D-IC Chiplet Integrated Power Supply With LDO, SCVR, and Buck DC–DC Converter https://sscs.ieee.org/wp-content/themes/movedo/images/empty/thumbnail.jpg 150 150 https://secure.gravatar.com/avatar/8fcdccb598784519a6037b6f80b02dee03caa773fc8d223c13bfce179d70f915?s=96&d=mm&r=g
Abstract:
With the rapid advancement of chiplet and heterogenous integration technologies, delivering power through the package, redistribution layer (RDL), and chip layers in 3-D space has become a fundamental challenge for high-performance SoCs. This letter provides a comprehensive overview of power delivery solutions, including low-dropout regulator (LDOs), switched capacitor converters, and …