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One-Cycle-Balance Control in Buck Converters for Consecutive Load-Step Events

One-Cycle-Balance Control in Buck Converters for Consecutive Load-Step Events 150 150
Author(s): Zihao Tang, Jiacheng Yang, Rui P. Martins, Mo Huang

Abstract:

One-cycle-balance (OCB) response represents the optimal load-transient response for buck converters, maximizing system energy efficiency and robustness. While prior art has demonstrated OCB response for single load-step events, it fails in consecutive transients, which are prevalent in modern applications. This work overcomes these limitations by introducing an OCB controller that …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 4975 – 4986
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3697453
Publisher: IEEE

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Medusa: A Scalable Quantum-Inspired k-SAT Solver With Make and Break Feedback

Medusa: A Scalable Quantum-Inspired k-SAT Solver With Make and Break Feedback 150 150
Author(s): Luke D. Wormald, Ying-Tuan Hsu, Evangelos Dikopoulos, Wei Tang, Benjamin Datsko, Ali Hammoud, Zhengya Zhang, Michael P. Flynn

Abstract:

Boolean satisfiability (SAT or $k$ -SAT, $k ge 3$ ) is a binary combinatorial optimization problem (COP) that is challenging for traditional classical computing to address in polynomial time. Quantum and quantum-inspired systems have been touted to tackle these and similar nondeterministic polynomial-time (NP) problems. This work describes Medusa, a quantum-inspired $k$ …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3726445
Publisher: IEEE

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A 65 nm Privacy-Preserving Neuromorphic Encoder With 7.13 nJ Efficiency, 2.38 Mb/mm2 2T–2T Item Memory Density and Federated Learning Support

A 65 nm Privacy-Preserving Neuromorphic Encoder With 7.13 nJ Efficiency, 2.38 Mb/mm2 2T–2T Item Memory Density and Federated Learning Support 150 150
Author(s): Boyang Cheng, Jianbo Liu, Steven Davis, Zephan M. Enciso, Likai Pei, Xueji Zhao, Muya Chang, Ningyuan Cao

Abstract:

The increasing demand for privacy-preserving personal data analytics in smart assistants and context-aware systems necessitates hardware that is both energy-efficient and secure. This work presents a 65 nm privacy-preserving neuromorphic encoder that addresses these challenges through physically uncloneable and hardware-efficient encoding. At the core of the architecture is a 2T–2T …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3721817
Publisher: IEEE

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An H-Band Continuous Broadband RF-Domain Quadrature Receiver Using a Harmonic-Enhanced LO Generator in 65-nm CMOS

An H-Band Continuous Broadband RF-Domain Quadrature Receiver Using a Harmonic-Enhanced LO Generator in 65-nm CMOS 150 150
Author(s): Weiping Wu, Xun Bao, Jingze Wang, Shi Chen, Shulan Chen, Yan Wang, Lei Zhang

Abstract:

This article presents an $H$ -band CMOS receiver chipset that covers a wide frequency range of 228–324 GHz, supporting the entire band of IEEE Std. 802.15.3d. The proposed receiver employs an RF-domain quadrature mixer-first architecture to alleviate the design burden of quadrature local oscillator (LO) signal generation in $H$ -band, which …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 4584 – 4599
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3697557
Publisher: IEEE

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TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles

TexCAC: A Direct-Textile-Attachable Microcontroller Integrating 2-MB MRAM for the Command and Control of Advanced Smart Textiles 150 150
Author(s): Jacob Mack, Qirui Zhang, He Wang, Yi Shen, Jeongtaek Chang, Heejin Yang, Anjali Agrawal, Zichen Fan, Braden Desman, Zane Lewis, Thomas Farrell, David Blaauw, Will Farrell, Jim Owens, Benton H. Calhoun, Dennis Sylvester

Abstract:

Advanced smart textiles (ASTs) are textile-integrated electronic systems that enable many applications, including healthcare, robotics, and IoT. ASTs contain a variety of electronic components to enable whole system functionality (batteries, sensors, SoCs, etc.), which all require orchestration from a central command-and-control (CAC) module. The primary functions of the CAC module …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 3307 – 3316
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3695482
Publisher: IEEE

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A Stress- and Temperature-Compensated TMR Current Sensor With ±0.13% Sensitivity Variation

A Stress- and Temperature-Compensated TMR Current Sensor With ±0.13% Sensitivity Variation 150 150
Author(s): Tianxiang Qu, Nan Wang, Zuo Zhang, Longxi Xiang, Ting Yi, Zhiliang Hong, Xiaoyang Zeng, Jiawei Xu

Abstract:

This article presents a high-precision tunnel magnetoresistance (TMR)-based non-contact current sensor with enhanced immunity to sensitivity drift. A background sensitivity stabilization loop (SSL) continuously regulates the TMR bias voltage to compensate intrinsic sensitivity variations. Through this closed-loop regulation, sensitivity drift of the TMR sensor induced by temperature, mechanical stress, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3719689
Publisher: IEEE

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A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter

A Line-Connected Q-Sampler-Based Multi-Phase Hybrid Converter 150 150
Author(s): Jiacheng Yang, Zihao Tang, Rui P. Martins, Zheng Wang, Lin Cheng, Mo Huang

Abstract:

This article presents a line-connected Q-sampler-based (LQS) multi-phase (MP) hybrid converter for direct conversion from high-rail to point-of-load (PoL). The proposed topology uses an input-parallel switched-capacitor (SC) structure to support “ALL-ON” operation during load transients, while a “multi-source- ${V}_{\mathrm { X}}$ ” control decouples voltage conversion ratio (VCR) from phase count, …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3718696
Publisher: IEEE

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THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications

THz-TSI: A Terahertz Wireless Through-Silicon Interconnect Module for Advanced 3-D Integration Applications 150 150
Author(s): Chen Jiang, Xiaodi Feng, Xiaohan Shen, Chixiao Chen, Qi Liu, Ming Liu, Ningsheng Xu

Abstract:

By vertically stacking device layers, advanced 3-D integration overcomes traditional planar scaling limits, delivering the bandwidth and power efficiency essential for modern artificial intelligence (AI) and high-performance computing (HPC) integrated systems. However, continued scaling of conventional through-silicon vias (TSVs) and microbumps presents critical bottlenecks due to inherent thermo-mechanical stress, complex …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3720291
Publisher: IEEE

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Raisu: A Radiation-Tolerant Neuromorphic Imager With In-Pixel Self-Healing and Unified Spiking Processing for Spaceborne Vision

Raisu: A Radiation-Tolerant Neuromorphic Imager With In-Pixel Self-Healing and Unified Spiking Processing for Spaceborne Vision 150 150
Author(s): Quan Cheng, Qiufeng Li, Zhengke Yang, Zhen Kong, Gaoqiang Niu, Yuan Liang, Jiamin Li, Jeong Hoan Park, Wang Liao, Hiromitsu Awano, Takashi Sato, Longyang Lin, Masanori Hashimoto

Abstract:

Spaceborne imaging systems operate under severe radiation and energy constraints, where single-event effects (SEEs), total ionizing dose (TID), and displacement damage dose (DDD) critically degrade reliability and performance. This work presents a radiation-tolerant neuromorphic imager prototype featuring a fully spike-based neuromorphic vision architecture with in-pixel self-healing capability and an integrated …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 14
Year of Publication: 2026
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2026.3715724
Publisher: IEEE

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