Special Section on Temperature Resilient Systems and Circuits
Temperature-resilient operation of systems and circuits has always been a key aspect of robust chip design. In particular, with applications in the automotive domain, space, and quantum computing, the need for temperature resilience over a wide temperature range or at cryogenic circumstances is becoming crucial. Besides that, new IC technologies with higher device densities and 3D stacking techniques induce more localized and temporal hotspots, creating the need for precise, fast, and local thermal monitoring and control. From both aspects, modeling, design methodologies, and circuit & system implementations are needed to monitor, control, and compensate for temperature effects.
This special section covers all aspects of temperature resilient systems and circuits, including but not limited to: temperature-robust design approaches, cryo-CMOS modeling and design strategies, embedded temperature sensors, thermal management in 3D-stacked chips, thermal monitoring and regulation in CPUs, temperature-compensated oscillators, clock generation circuits, and references. Original research contributions describing new integrated circuits and systems as well as detailed and comprehensive review articles are desired.
Authors are invited to submit papers following the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS) guidelines, within the remit of this Special Section call. Topics include (but are not limited to):
- Temperature robust techniques for voltage references, oscillators, amplifiers, ADCs/DACs, PAs, drivers, and other key circuits
- Thermal monitoring and regulation in SoCs, CPUs and other processing units
- Thermal management for 3D and heterogeneous integration
- Cryogenic system and circuit designs, including modeling aspects and design methodologies
- Wide temperature-range circuits for special applications
- Embedded temperature sensors
Submission Guidelines
All submitted manuscripts are strongly encouraged to:
- conform to OJ-SSCS’ normal formatting requirements and page count limits;
- validate principal claims with experimental results;
- be submitted online at: https://mc.manuscriptcentral.com/oj-sscs
Please note that you need to select “Temperature Resilient Systems and Circuits” when you submit a paper to this Special Section.
Deadlines
Special Section Open for Submissions: May 1, 2025
Paper Submission Deadline: July 24, 2025
First Notification: August 31, 2025
Revision Submission: September 30, 2025
Final Decision: November 15, 2025
Publication Online: December 8, 2025