OJ-SSCS Special Issue on RF Circuits and Wireless Transceivers
RF circuits and wireless transceivers form the backbone of modern wireless communication systems, playing a pivotal role in enabling seamless data transmission across various frequency ranges, from radio frequencies (RF) to millimeter-wave (mmWave) and terahertz (THz) frequencies. These components are essential for the functioning of critical communication networks like 5G, and in the near future, beyond-5G and 6G technologies, which promise higher data rates, lower latency, and enhanced connectivity. RF circuits and wireless transceivers are also vital in satellite communication, radar systems for defense and automotive applications, Internet of Things (IoT) devices, implantable/wearable medical devices, and even in imaging systems. The evolution of wireless communication demands continuous innovation in these areas to overcome challenges like signal degradation, interference, power consumption, and spectrum efficiency. Moreover, advancements in RF and wireless transceiver are enabling the integration of multiple functionalities, such as communication and sensing, within a single system-on-chip (SoC). This trend toward integration is crucial for reducing system size, cost, and power consumption while enhancing performance, especially in emerging applications like autonomous vehicles, smart cities, biomedicines, and medical imaging. As wireless systems become more complex, innovations in RF circuits and transceivers are key to meeting the growing demand for bandwidth and improving spectral and energy efficiency. In this rapidly evolving landscape, RF circuits and wireless transceivers will continue to be a cornerstone for the advancement of next-generation wireless technologies, enabling the future of global connectivity and sensing solutions.
This special issue primarily focuses on comprehensive solutions and building blocks at RF, mm-Wave, and THz frequencies for receivers, transmitters, frequency synthesizers, RF filters, transceivers, SoCs, and wireless SiPs incorporating multiple chiplets. Innovative circuits, systems, design techniques, heterogeneous packaging solutions, etc. for established wireless standards as well as future systems or novel applications, such as sensing, radar, and imaging, and those improving spectral and energy efficiency. Original research contributions describing new integrated circuits and systems are desired, also in-depth and comprehensive review articles are welcomed.
Authors are invited to submit papers following the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS) guidelines, within the remit of this Special Section call. Topics include (but are not limited to):
- RF, millimeter-wave, and THz transceivers for wireless communication
- Integrated radar, imaging, spectroscopy, and sensing circuits at RF through THz frequencies.
- Frequency synthesis and LO generation
- Innovative circuit and architecture for 5G and beyond, radar, imaging, biomedical, and optoelectronic systems
- Ultra-low power and miniature radio systems
- Heterogeneous packaging solutions for wireless systems
Submission Guidelines
Submission Guidelines: https://sscs.ieee.org/publications/ieee-open-journal-of-the-solid-state-circuits-society/oj-sscs-submission/
Please note that you need to select “RF Circuits and Wireless Transceivers” when you submit a paper to this Special Issue.
Deadlines
- Special Section Open for Submissions: January 27, 2025
- Paper Submission Deadline: February 28, 2025
- First Notification: March 24, 2025
- Revision Submission: April 21, 2025
- Final Decision: May 5, 2025
- Publication Online: May 30, 2025