OJ-SSCS Special Issues

OJ-SSCS is now accepting submissions for two special issues:

Information on these two special issues can be found below and on the lefthand menu. 


CALL FOR PAPERS - Special issue on Electronic-photonic integrated circuits (EPIC)

Combining the advantages of devices, circuits, and architectures in both electronic and photonic domains can profoundly impact both fields resulting in advances in several areas such as communications, computation, imaging, and sensing. With the rapid growth of artificial intelligence systems, video streaming, and cloud services, we are witnessing an ever-increasing demand for higher capacity and faster networks. By leveraging the CMOS-compatible silicon photonics and the advanced electronic processes, optical transceivers for next generation networks can be implemented. The co-design of the photonic devices with RF and mm-wave electronic circuits enables realization of high-speed low-power and low-cost integrated transceivers. Furthermore, the low loss of the optical medium (such as waveguides), as well as high bandwidth available in optical frequencies can be utilized to improve the performance of an existing electronic system. Low-loss optical delays and high quality factor resonators available in the photonic integrated circuits can be used to perform optically assisted electrical signal processing as well as low noise microwave signal generation and control.

Integrated electronic-photonic co-design has also enabled realization of low-cost and highly scalable optical phased arrays with applications such as solid-state LiDAR and 3D imaging.

Authors are invited to submit papers following the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS) guidelines, within the remit of this Special Issue call.

Topics include novel advances in integrated electronic-photonic circuits and systems including but not limited to:

• Low-power high data-rate optical transceivers for data centers
• Free-space optical communication systems
• Optical phased arrays, imagers, and LiDAR systems
• Electronic-photonic sensing systems
• Integrated microwave photonic systems
• Low phase noise clocks
• Integrated photonic-electronic computing systems
• Non-silicon integrated photonic circuits

 

Submission Guidelines:

All submitted manuscripts must-

(i) conform to OJ-SSCS' normal formatting requirements and page count limits;
(ii) incorporate no less than 70% of new (previously unpublished) material;
(iii) validate principal claims with experimental results;
(iv) be submitted online at: https://mc.manuscriptcentral.com/oj-sscs Please note that you need to select "Electronic-photonic integrated circuits (EPIC)”, when you submit a paper to this Special Issue.

 

Deadlines:

·    Call open for Submissions: April 1, 2021

·    Paper Submission: July 14, 2021 DEADLINE EXTENDED!

·    Completion of First Review: August 31, 2021

·    Completion of revised manuscript: September 30, 2021

·    Completion of Final Review: October 31, 2021

·    Target Publication: November-December 2021

Guest Editor:

Dr. Firooz Aflatouni

The University of Pennsylvania, Email: firooz@seas.upenn.edu 


 CALL FOR PAPERS - Special issue on Imagers for 3D vision

Depth perception has been and continues to be one of the fastest growing fields of research and development both in academia and industry. There is an abundance of applications requiring 3D vision, from automotive safety and self-driving vehicles to virtual/augmented reality (VR/AR), from high-end imaging to proximity sensing. With the explosion of automated package handling, semi-robotic delivery, and advanced driver-assistance systems (ADAS), the need to safely and accurately reconstruct the environment in 3D is also exploding, along with more demanding requirements for 3D vision cameras in terms of resolution, precision, and speed.

To realize cameras and, more generally, imagers optimized for 3D vision, academic and industrial labs have generated a flurry of designs, often with the help of and in collaboration with CMOS image sensor technologists, who have created new solutions to more effectively address 3D vision problems. An obvious example is the creation of 3D stacking that has allowed packing more and more advanced functionalities in a single chip for the capture and interpretation of 2D/3D images. These technological advances would not have been possible without the economies of scale that have continued pushing for a smaller feature size in integrated circuits. Another clear push for deep learning and artificial intelligence, applied to 3D vision, is apparent now. This is requiring significant hardware-based accelerators that are often integrated on the imager chip. In this special issue we want to explore imagers for 3D vision, their applications, and the technologies that have made all these advances possible.

Authors are invited to submit papers following the IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS) guidelines, within the remit of this Special Issue call.

Topics include novel advances for imagers for 3D vision such as (but not limited to):

• Novel principles and architectures for 3D vision
• Flash and scanned LiDAR
• High-speed hardware for 3D vision
• Embedded deep-learning engines for 3D vision
• Advanced pixels for imaging in 3D
• SPAD imagers
• MEMS for fast and reliable 3D vision
• 3D-stacking technologies supporting advanced imaging functionalities
• The readout bottleneck and localized processing/compression

Submission Guidelines:

All submitted manuscripts must-

(i) conform to OJ-SSCS' normal formatting requirements and page count limits;

(ii) incorporate no less than 70% of new (previously unpublished) material;

(iii) validate principal claims with experimental results;

(iv) be submitted online at: https://mc.manuscriptcentral.com/oj-sscs Please note that you need to select "Imagers for 3D vision", when you submit a paper to this Special Issue.

 

Deadlines:

·    Call open for Submissions: April 1, 2021

·    Paper Submission: July 14, 2021 DEADLINE EXTENDED!

·    Completion of First Review: August 31, 2021

·    Completion of revised manuscript: September 30, 2021

·    Completion of Final Review: October 31, 2021

·    Target Publication: November-December 2021

 

Guest Editor:

Prof. Edoardo Charbon

EPFL, Email: edoardo.charbon@epfl.ch