Abstract: Three-dimensional integrated circuits (3D ICs) are shaping the future of AI hardware by stacking multiple chips vertically to achieve higher bandwidth, lower latency, and better energy efficiency. But this […]
Abstract: Traditionally, chip-scale RF system design has been in the domain of the expert, dominated by thumb rules and trial-and-error techniques. Designing these ICs, which form the bedrock of wireless […]
Abstract: With emerging trends such as machine learning, the internet of everything, brain–machine interfaces, autonomous driving, 6G communications, and quantum computing, circuit designers are increasingly challenged to achieve drastic improvements […]
