"Low-Power, High-Bandwidth, and Ultra-Small Memory Module Design", presented by Jake Baker
- 2015-06-24 - 2015-06-24
- Webinar - Online
- Michael Markowycz – firstname.lastname@example.org
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Russel Jacob (Jake) Baker (S’83-M’88-SM’97-F'13) was born in Ogden, Utah, on October 5, 1964. He received the B.S. and M.S. degrees in electrical engineering from the University of Nevada, Las Vegas, in 1986 and 1988. He received the Ph.D. degree in electrical engineering from the University of Nevada, Reno in 1993. His Google scholar profile is located here.
From 1981 to 1987 he served in the United States Marine Corps Reserves (Fox Company, 2nd Battalion, 23rd Marines, 4th Marine Division). From 1985 to 1993 he worked for E. G. & G. Energy Measurements and the Lawrence Livermore National Laboratory designing nuclear diagnostic instrumentation for underground nuclear weapons tests at the Nevada test site. During this time he designed over 30 electronic and electro-optic instruments including high-speed fiber-optic receiver/transmitters, PLLs, frame- and bit-syncs, data converters, streak-camera sweep circuits, Pockell’s cell drivers, micro-channel plate gating circuits, and analog oscilloscope electronics. In 1991-1992 he was an adjunct faculty member in the department of electrical engineering at the University of Nevada, Las Vegas (UNLV). From 1993 to 2000 he served on the faculty in the department of electrical engineering at the University of Idaho. In 2000 he joined a new electrical and computer engineering program at Boise State University (BSU) where he served as department chair from 2004 to 2007. At BSU he helped establish graduate programs in electrical and computer engineering including, in 2006, the university’s second PhD degree. In 2012 he re-joined the faculty at UNLV where he is currently a Professor of Electrical and Computer Engineering. In addition to this industry and academic experience, he has done technical and expert witness consulting for numerous companies and laboratories.
Over the last 30 years his research and development interests have been, or currently are, focused on the design of diagnostic electrical and electro-optic instrumentation for scientific research, integrated electrical/biological circuits and systems, array (memory, imagers, and displays) circuit design, CAD tool development and online tutorials, low-power interconnect and packaging techniques, design of communication/interface circuits, circuit design for the use and storage of renewable energy, power electronics, and the delivery of online engineering education.
Professor Baker holds 137 US patents. He is a member of the honor societies Eta Kappa Nu and Tau Beta Pi, a licensed Professional Engineer, a popular lecturer that has delivered over 50 invited talks around the world, an IEEE Fellow, and the author of the books CMOS Circuit Design, Layout, and Simulation, CMOS Mixed-Signal Circuit Design, and a coauthor of DRAM Circuit Design: Fundamental and High-Speed Topics. He received the 2000 Best Paper Award from the IEEE Power Electronics Society, the 2007 Frederick Emmons Terman Award, and the 2011 IEEE Circuits and Systems Education Award. He currently serves on, or has served on, the IEEE Press Editorial Board (1999-2004), as editor for the Wiley-IEEE Press Book Series on Microelectronic Systems (2010-present), the IEEE Solid-State Circuits Society (SSCS) Administrative Committee (2011-2016), as a Distinguished Lecturer for the SSCS (2013-2014), and as the Technology Editor (2012-2014) and Editor-in-Chief (2015 - present) for the IEEE Solid-State Circuits Magazine.
The main memory subsystem has become inefficient. Sustaining performance gains has power consumption, capacity, and cost moving in the wrong direction. This talk proposes novel module, DRAM, and interconnect architectures in an attempt to alleviate these trends. The proposed architectures utilize inexpensive innovations, including interconnect and packaging, to substantially reduce the power, and increase the capacity and bandwidth of the main memory system. A low cost advanced packaging technology is used to propose an 8 die and 3 32-die memory module. The 32-die memory module measures less than 2 cm . The size and packaging technique allow the memory module to consume less power than conventional module designs. A 4 Gb DRAM architecture utilizing 64 data pins is proposed. The DRAM architecture is inline with ITRS roadmaps and can consume 50% less power while increasing b d id h b h l b f d i bandwidth by 100%. The large number of data pins are supportedb l y aow power capaci it vecoupled interconnect. The receivers developed for the capacitive interface were fabricated in 0.5 µm and 65 nm CMOS technologies. The 0.5 µm design operated at 200 Mbps, used a coupling capacitor of 100 fF, and consumed less than 3 pJ/bit of energy. The 65 nm design operated 4 atGbps, used li i f 1 d a coupling capacitor of 15 fF, and dl h 1 d consumed less than 15 fJ/bit.
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