IEEE Journal on Exploratory Solid-State Computational Devices and Circuits – Journals

Quantum Field Theory Model for Spin-Based Devices Using 2-D van der Waals Materials

Quantum Field Theory Model for Spin-Based Devices Using 2-D van der Waals Materials 150 150

Abstract:

We explore the effects of layered geometries of 2-D quantum spin systems as a method to tune and control material properties for spintronic devices. We analyze the dispersion relation of a 2-D quantum spin system with a shifted bilayer square lattice through the linear spin wave (LSW) approximation of quantum …

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1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations

1.58-b FeFET-Based Ternary Neural Networks: Achieving Robust Compute-In-Memory With Weight-Input Transformations 150 150

Abstract:

Ternary weight neural networks (TWNs), with weights quantized to three states (−1, 0, and 1), have emerged as promising solutions for resource-constrained edge artificial intelligence (AI) platforms due to their high energy efficiency with acceptable inference accuracy. Further energy savings can be achieved with TWN accelerators utilizing techniques such as compute-in-memory (CiM) and …

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Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node

Comprehensive Device to System Co-Design for SOT-MRAM at the 7 nm Node 150 150

Abstract:

This work presents a comprehensive spin-orbit torque (SOT)-based magnetic random access memory (MRAM) design at the 7 nm technology node, spanning from device-level characteristics to system-level power performance area (PPA). At the device level, we show the tradeoffs among the write current, error rate, and time, based on mircomagnetic simulations. …

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Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs

Understanding Reliability Trade-Offs in 1T-nC and 2T-nC FeRAM Designs 150 150

Abstract:

Ferroelectric random access memory (FeRAM) is a promising candidate for energy-efficient nonvolatile memory, particularly for logic-in-memory and compute-in-memory (CIM) applications. Among the available cell architectures, One-Transistor–n-Capacitor (1T-nC) and two-transistor–n-capacitor (2T-nC) FeRAMs each offer distinct trade-offs in density, scalability, and reliability. In this work, we present a comparative study …

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Non-Volatile ReRAM-Based Compact Event-Triggered Counters

Non-Volatile ReRAM-Based Compact Event-Triggered Counters 150 150

Abstract:

With an increasing number of transistors per circuit, the fabrication cost and the energy consumption of each integrated circuits increase exponentially, which drives the need to reduce the number of transistors. In this study, we explore a novel design for a 16-bit digital counter that utilizes a combination of complementary …

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Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model

Benchmarking of FERAM-Based Memory System by Optimizing Ferroelectric Device Model 150 150

Abstract:

We present a framework for design technology co-optimization (DTCO) of the main memory system with one transistor-one capacitor (1T1C) ferroelectric random access memory (FERAM) as an alternative to dynamic random access memory (DRAM). We start with the ferroelectric capacitor device model and perform array-level memory circuit simulation. Then, we …

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Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling

Beyond Backside Power: Backside Signal Routing as Technology Booster for Standard-Cell Scaling 150 150

Abstract:

Advances in process technology enabling backside metals (BSMs) and contacts offer new design–technology co-optimization (DTCO) opportunities to further enhance power, performance, and area gains (PPA) in sub-3-nm nodes. This work exploits backside (BS) contact technology within standard cells to extend both signal and clock routing to BSM layers, …

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A Bit-Cell Failure Analysis Framework for Ferroelectric Field-Effect Transistor-Based Memories

A Bit-Cell Failure Analysis Framework for Ferroelectric Field-Effect Transistor-Based Memories 150 150

Abstract:

The ferroelectric field-effect transistor (FeFET) is a promising memory device technology due to desirable attributes, such as fast access times, high memory cell density, good endurance, compatibility with CMOS process, and impressive scalability. While previous research has explored the impact of process variations at the device level, their effects on …

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3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency

3-D Stacked HBM and Compute Accelerators for LLM: Optimizing Thermal Management and Power Delivery Efficiency 150 150

Abstract:

Advanced packaging is becoming essential for designing hardware accelerators for large language models (LLMs). Different architectures, such as 2.5-D integration of memory with logic, have been proposed; however, the bandwidth limits the throughput of the complete system. Recent works have proposed memory on logic systems, where high bandwidth memory (HBM) …

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