IEEE Journal on Exploratory Solid-State Computational Devices and Circuits – Early Access

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Sensing- and Periphery-Aware Modeling of a Hybrid MTJ–CMOS Nonvolatile One-Bit Sign-Weight Memory Subsystem for Energy-Constrained Edge Inference

Sensing- and Periphery-Aware Modeling of a Hybrid MTJ–CMOS Nonvolatile One-Bit Sign-Weight Memory Subsystem for Energy-Constrained Edge Inference 150 150
Author(s): Byeong-Gwon Kim, Byeong-Kwon Ju, Ki-Young Lee

Abstract:

Spin-transfer-torque magnetic random-access memory (STT-MRAM) is attractive for nonvolatile one-bit sign-weight storage, but a favorable cell or local-read metric does not establish subsystem efficiency. We analyze a hybrid magnetic tunnel junction (MTJ)–complementary metal-oxide-semiconductor (CMOS) memory subsystem in which MTJs store static signs while sensing, reference generation, sign staging, scale …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3726699
Publisher: IEEE

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A Current-Mode Non-Destructive Circuit Readout Scheme for High-Density 3D Ferroelectric Memory

A Current-Mode Non-Destructive Circuit Readout Scheme for High-Density 3D Ferroelectric Memory 150 150
Author(s): CHaohan Wang, Wagdy Hussein, Yang Xiang, Shankha Mukherjee, Ismail Cevik, Fernando García-Redondo, Annachiara Spagnolo, Hyungrock Oh, Marie Garcia Bardon, Nick Van Helleputte, Julien Ryckaert, Geert Hellings, Dwaipayan Biswas, Jan Van Houdt

Abstract:

The AI era is demanding ever-increasing memory capacity and bandwidth, where 3D-stacked ferroelectric memory (FeRAMs) utilizing nondestructive readout (NDRO) ferroelectric capacitors (FeCAPs) stand as a promising candidate. This work addresses NDRO sensing signal challenges in deeply scaled 3D FeRAMs using a current-mode sensing scheme, co-designed with the device architecture to …

Published in: IEEE Journal on Exploratory Solid-State Computational Devices and Circuits
Page(s): 1 – 1
Year of Publication: 2026
Electronic ISSN: 2329-9231
DOI: 10.1109/JXCDC.2026.3727137
Publisher: IEEE

View on IEEE Xplore

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