IEEE Journal of Solid-State Circuits

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AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm

AACIM: A 2785-TOPS/W, 161-TOP/mm2, <1.17%-RMSE, Analog-In Analog-Out Computing-In-Memory Macro in 28 nm 150 150
Author(s): Rentao Wan, Chuan-Tung Lin, Bo Zhang, Yannis Tsividis, Mingoo Seok

Abstract:

This article presents an analog-in analog-out CIM macro (AACIM) for use in analog deep neural network (DNN) processors. Our macro receives analog inputs, performs a 64-by-32 vector–matrix multiplication (VMM) with a current-discharging computation mechanism, and produces analog outputs. It stores a 4-bit weight as an analog voltage in the …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 11
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3622309
Publisher: IEEE

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A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source

A 14-b Energy-Efficient BW/Power Scalable CTDSM With a Frequency-Controlled Current Source 150 150
Author(s): Xinjie Wu, Xiaopeng Yu, Nick Nianxiong Tan, Zhong Tang

Abstract:

This work presents a 14-bit energy-efficient bandwidth (BW)/power scalable continuous-time delta–sigma modulator (CTDSM) for sensor interfaces in IoT applications. To ensure low noise for small input signals and achieve BW/power scalability, it is built around Gm-C integrators biased via a linear frequency-controlled current source (FCCS). The FCCS …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 10
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3621527
Publisher: IEEE

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A Compact, Highly-Digital Sensor-Fusion-Based Joint V dd-Temperature Sensor for SoC Thermal Management

A Compact, Highly-Digital Sensor-Fusion-Based Joint V dd-Temperature Sensor for SoC Thermal Management 150 150
Author(s): Hikmet Seha Öztürk, Julian Arenas, Carlos Tokunaga, Nasser Kurd, Visvesh S. Sathe

Abstract:

This article presents a fine-grained thermal sensing network for thermal management in SoCs. Sensor nodes in this network are made up of joint supply voltage ( $V_{\mathrm {dd}}$ ) and temperature ( $T$ ) sensors, which are compact and highly digital. Measurements from these simple but imperfect sensors are jointly processed to extract …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3621280
Publisher: IEEE

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A 0.4-V 32-kHz Pulse-Injection Temperature-Compensated Crystal Oscillator With Sub-Cycle CL Modulation and DLL-Reused Temperature Sensor

A 0.4-V 32-kHz Pulse-Injection Temperature-Compensated Crystal Oscillator With Sub-Cycle CL Modulation and DLL-Reused Temperature Sensor 150 150
Author(s): Haihua Li, Pui-In Mak, Rui P. Martins, Ka-Meng Lei

Abstract:

This article presents a 0.4-V 32 kHz pulse-injection (PI) temperature-compensated crystal oscillator (TCXO) that incorporates subcycle capacitive load ( $C_{\text {L}}$ ) modulation for frequency compensation. The proposed TCXO compensates for the crystal’s frequency deviation ( $\Delta f$ ) by dynamically adjusting the enabling duration of the additional $C_{\text {L}}$ within each …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3620824
Publisher: IEEE

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Frequency-Agile Self-Interference Cancellation in a Wideband Compact Full-Duplex Receiver Using Cascaded Low-Noise and High-Delay-Bandwidth-Product APFs

Frequency-Agile Self-Interference Cancellation in a Wideband Compact Full-Duplex Receiver Using Cascaded Low-Noise and High-Delay-Bandwidth-Product APFs 150 150
Author(s): Xingyu Ma, Wei Li, Shijiao Dong, Ruiyu Lyu, Fan Chen, Yunyou Pu, Chuangguo Wang, Hongtao Xu

Abstract:

Wideband self-interference cancellation (SIC) in a full-duplex (FD) system requires the cancellers to achieve flat nanosecond-scale RF delay while minimizing the noise penalty to the receiver (RX). This work proposes: 1) cascadable hybrid low-noise first-order all-pass filters (APFs) in the first tap of the RF canceller to reduce the noise figure (…

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 15
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3618610
Publisher: IEEE

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Space-Mate: A 303.5-mW Real-Time Sparse Mixture-of-Experts-Based NeRF-SLAM Processor for Mobile Spatial Computing

Space-Mate: A 303.5-mW Real-Time Sparse Mixture-of-Experts-Based NeRF-SLAM Processor for Mobile Spatial Computing 150 150
Author(s): Gwangtae Park, Seokchan Song, Haoyang Sang, Dongseok Im, Donghyeon Han, Sangyeob Kim, Hongseok Lee, Hoi-Jun Yoo

Abstract:

Simultaneous localization and mapping (SLAM) provides crucial ego-pose information and 3-D maps of the user environment, which are fundamental to emerging mobile spatial computing devices. Dense 3-D mapping and accurate pose estimation are particularly necessary for applications like augmented reality (AR) and autonomous navigation. However, existing SLAM processors are typically …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3610931
Publisher: IEEE

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A Standardized 20-Tb/s Bandwidth Scalable Heterogeneous 2.5-D System Supporting Assembly Time Workload-Dependent Chiplet Configurations

A Standardized 20-Tb/s Bandwidth Scalable Heterogeneous 2.5-D System Supporting Assembly Time Workload-Dependent Chiplet Configurations 150 150
Author(s): Srivatsa Rangachar Srinivasa, Dileep J. Kurian, Paolo A. Aseron, Prerna Budhkar, Vinayak Honkote, Daniel Lake, Mikhail Moiseev, Robert Munoz, Anuradha Srinivasan, Tanay Karnik

Abstract:

The increasing adoption of chiplet-based architectures highlights the compelling paradigm of disaggregating monolithic systems into interconnected chiplets, offering numerous advantages for heterogeneous integration. This disaggregation is essential as chips approach the reticle limit, improving yield and design flexibility by combining diverse functionalities. Next-generation 2.5-D systems require enhanced interoperability across heterogeneous …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 12
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3613339
Publisher: IEEE

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A Stochastic Analog Boolean Satisfiability Solver

A Stochastic Analog Boolean Satisfiability Solver 150 150
Author(s): Shiyu Su, Qiaochu Zhang, Zerui Liu, Hsiang-Chun Cheng, Zhengyi Qiu, Mayank Palaria, Jiacheng Ye, Deming Meng, Buyun Chen, Sushmit Hossain, Wei Wu, Mike Shuo-Wei Chen

Abstract:

This article presents a stochastic analog Boolean satisfiability (SAT) solver, featuring a fast open-loop architecture with continuous-time (CT) self-loopback pull-up switches, a discrete-time (DT) scrambling scheme, and a cost-efficient hybrid random code generator. The SAT prototype demonstrates 100% solvability and 3.5- $\mu $ s solution time with 8.6-nJ energy consumption for 1000 hard …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 13
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3617458
Publisher: IEEE

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A “No Gain” Direct-Conversion IQ RF-to-Bits Receiver Without Active Linear Amplification

A “No Gain” Direct-Conversion IQ RF-to-Bits Receiver Without Active Linear Amplification 150 150
Author(s): Jeroen Ponte, Roel Plompen, Emiel Zijlma, Eric A. M. Klumperink, Harijot Singh Bindra, Bram Nauta

Abstract:

This work describes a direct-conversion IQ receiver (RX) that does not utilize any active linear (power) amplification, covering its design considerations, prototype implementation, and measurement verification. Only RLC components, MOS transistor (MOST) switches, and comparators are used, leading to several unique design challenges. Key among these are the fact that …

Published in: IEEE Journal of Solid-State Circuits
Page(s): 1 – 17
Year of Publication: 2025
Electronic ISSN: 1558-173X
DOI: 10.1109/JSSC.2025.3611114
Publisher: IEEE

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