SSCD Events

< Back to events

Solid-State Circuits Directions Workshop - Active Antennas Towards THz

2021-10-11 - 2021-10-12
9:00 AM ET (Both Days)
Online - Virtual
IEEE Region 1 (Northeastern USA)
Danielle Marinese –
Solid-State Circuits Directions (SSCD) is a new technical committee within the IEEE Solid-State Circuits Society (related article). Its charter is to promote forward-looking topics, build new communities and stimulate interaction with others. Following SSCD’s inaugural event on hardware security and the workshop on democratizing the IC design, the upcoming workshop will look at the new trend toward active antennas at millimeter-wave up to terahertz frequencies. 


Integration of antennas on silicon becomes feasible at frequencies above 100 GHz due to wavelength-related size reduction. The goal of this workshop is to give a vision on potential emerging applications towards THz and present the latest developments on integrated antennas, co-design with active circuits at high mm-wave frequencies. The workshop comprises two days, each rounded up by a panel discussion. The first day will be rounded up by a panel discussion, to discuss the following points: does it make sense to go to frequencies above 100 GHz? Which applications might profit by this? Which frequency bands become available? Does it make sense from the commercial point of view? The second day will be rounded up by a discussion on where and how shall we realize antennas.

AGENDA – DAY 1 “Breaking THz Frontiers

6:00 AM PDT     Welcome & Introductions (Vadim Issakov, TU Braunschweig, Germany)

6:05 AM PDT     Vision towards 6G communication and secure channels at THz frequencies (Gerhard Fettweis, TU Dresden, Germany)

6:35 AM PDT     Vision on CMOS and BiCMOS technologies towards THz applications (Ned Cahoon, Globalfoundries, USA)

7:05 AM PDT     Coffee break

7:15 AM PDT     Reconfigurable THz Sensors and Surfaces: Opportunities in a New Design Space (Kaushik Sengupta, Princeton University, USA)

7:45 AM PDT     Minimalism in a Demanding THz Era: Multi-Functional and Multi-Resonance Antennas On Silicon Chips (Ruonan Han, Massachusetts Institute of Technology, USA)

8:15 AM PDT     Coffee break

8:20 AM PDT     Panel Discussion: “Do we really need THz frequencies?”

Gerhard Fettweis (TU Dresden), Ned Cahoon (Globalfoundries), Kaushik Sengupta (Princeton), Ruonan Han (MIT), Uwe Rueddenklau (Infineon Technologies), Sorin Voinigescu (University of Toronto), Gabriel Rebeiz (UC San Diego)

9:00 AM PDT     Adjourn Day 1

AGENDA – DAY 2 “Merging Antennas and Active Circuits”

6:00 AM PDT     Circuit/antenna co-design for 140 GHz CMOS radar (Ilja Ocket, imec, Belgium)

6:30 AM PDT     Advances in Full-Physics Simulation for Active Beamsteering (Devin Crawford, ANSYS)

7:00 AM PDT     Interactive Session using Jupyter Notebook

7:05 AM PDT     Virtual Coffee break

7:15 AM PDT     Vision on mm-Wave Packaging, co-Design and embedded Antennas towards THz (Thomas Zwick, Karlsruhe Institute of Technology, Germany)

7:45 AM PDT     Holistic Co-Designs of Mm-Wave Circuits with Electromagnetics and Radiation (Hua Wang, ETH Zürich, Switzerland)

8:15 AM PDT     Coffee break

8:20 AM PDT     Panel Discussion: “Where shall our antennas be and what shall we do with them?”

Thomas Zwick (Karlsruhe Institute of Technology), Devin Crawford (ANSYS), Ned Cahoon (Globalfoundries), Ilja Ocket (imec), Hua Wang (ETH Zürich), Sorin Voinigescu (University of Toronto), Gabriel Rebeiz (UC San Diego)

9:00 AM PDT     Adjourn Day 2

Gerhard Fettweis

Gerhard Fettweis (Fellow IEEE) received the Ph.D. degree, under the supervision of H. Meyr, from RWTH Aachen. After one year at IBM Research, San Jose, he moved to TCSI, Berkeley. Since 1994, he has been a Vodafone Chair Professor with Technische Universitaet Dresden. Since 2018, he has been the Head of the Barkhausen Institute. He researches wireless transmission and chip design, coordinates two DFG centers (cfaed and HAEC), the 5GLab Germany, has spun-out sixteen startups. He is a member of two German academies: (Sciences) Leopoldina and (Engineering) acatech.

Ned Cahoon

Ned Cahoon received an A.B. degree in physics from Harvard University in 1980.  He joined IBM in 1980 in Poughkeepsie, NY, where he worked in engineering and management positions responsible for DRAM reliability and assurance in IBM’s Data System Division.  In 1988, he moved to IBM’s Microelectronics Division where he contributed to the research and development of AlGaAs and InP laser technology.  Beginning in 1991, he managed engineering teams in IBM’s MLC packaging lab and manufacturing plant.  In 1995, he was part of a new business initiative within IBM with the mission to develop and commercialize SiGe technology, and he has been involved in business development of SiGe and RFSOI technologies at IBM and now GlobalFoundries ever since.  He is currently a Director in the CTO Office of the Mobility and Wireless Infrastructure Business Unit at GlobalFoundries.

Kaushik Sengupta

Kaushik Sengupta is currently an Associate Professor and Director of Graduate Studies in Electrical and Computer Enringing at Princeton University.  He received the B.Tech. and M.Tech. degrees in electronics and electrical communication engineering from IIT Kharagpur, Kharagpur, India, in 2007, and the Ph.D. degrees in electrical engineering from Caltech, Pasadena in 2012. He is the director of the Integrated Microsystems Research lab  at Princeton focusing on electronic and photonic integrated systems for various applications in sensing, imaging, and high-speed communication.

Dr. Sengupta received the Bell Labs Prize (2017), Young Investigator Program (YIP) Award from the Office of Naval Research in 2017, the DARPA Young Faculty Award (2018),  the 2015 MTT-S Microwave Prize, and 2021 IEEE Microwave Theory and Techniques Outstanding Young Engineer Award. He served as a Distinguished Lecturer for IEEE Solid-State Circuits Society (2019-2020), and is currently serving as the Distinguished Lecturer for IEEE Microwave Theory and Techniques (2021-2023).

Ruonan Han

Ruonan Han (S’10-M’14-S’19) received the B.Sc. degree in microelectronics from Fudan University, China , in 2007, the M.Sc. degree in electrical engineering from the University of Florida, Gainesville, FL, USA, in 2009, and the Ph.D. degree in electrical and computer engineering from Cornell University, Ithaca, NY, USA, in 2014. In 2012, he was an intern with Rambus Inc., Sunnyvale, CA. He is currently an associate professor with the Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA, USA. His current research interests include microelectronic circuits and systems operating at millimeter-wave and terahertz frequencies.

Ilja Ocket

Ilja Ocket received the M.Sc. and Ph.D. degrees in electrical engineering from KU Leuven, Leuven, Belgium, in 1998 and 2009, respectively. He currently serves as a Program Manager for neuromorphic sensor fusion at the IoT Department, imec, Leuven. He is also involved in research on using broadband impedance sensing and dielectrophoretic actuation for lab-on-chip applications. His research interests include all aspects of heterogeneous integration of highly miniaturized millimeter-wave systems, spanning design, technology, and metrology.

Devin Crawford

Devin Crawford has held numerous R&D roles since receiving his Ph.D. in Electrical Engineering in 1996 at the University of Minnesota (USA).  His areas of research have been broad, ranging from the study of GaN epitaxy and growth kinetics for his Ph.D. thesis, to laser diode design and applied numerical methods for electromagnetics.  Early in his career he worked as an RF and microwave design engineer developing antennas, passive RF components and filters, and joined Ansoft as an application engineer in 2002.

He left Ansys (former Ansoft) in 2011 but returned in 2018, first leading business development for the enterprise customers and subsequently taking over leadership of Ansys’ application engineering team targeting applied electromagnetics in the European market. Prior to joining ANSYS, he led development of high-power laser diodes at Lasertel, Inc. in Tucson AZ. 

His impact has been demonstrated by several patents, publications and multiple speaking engagements at conferences and marketing events. He has long been an advocate of applied numerical methods to improve product development processes. His passion to share this success with a broader audience was a key factor motivating him to return to Ansys in 2018.

Thomas Zwick

Thomas Zwick received the Dipl.-Ing. and the Dr.-Ing. degrees from the Universität Karlsruhe (TH), Germany, in 1994 and 1999, respectively. In February 2001, he joined IBM as research staff member at the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA. From October 2004 to September 2007, Thomas Zwick was with Siemens AG, Lindau, Germany, managing the RF development team for automotive radars. In October 2007, he became a full professor at the Karlsruhe Institute of Technology (KIT), Germany. He is the director of the Institute of Radio Frequency Engineering and Electronics at the KIT. Since 2017 he is member of the Heidelberg Academy of Sciences and Humanities. In 2018 Thomas Zwick became appointed IEEE Fellow. In 2019 he became the Editor in Chief of the IEEE Microwave and Wireless Components Letters. Since 2019 he is a member of acatech (German National Academy of Science and Engineering).

Hua Wang

Hua Wang (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from the California Institute of Technology, Pasadena, CA, USA, in 2007 and 2009, respectively.,He worked at Intel Corporation, Santa Clara, CA, USA, and Skyworks Solutions, Irvine, CA, USA. He is currently an Associate Professor with the School of Electrical and Computer Engineering (ECE), Georgia Institute of Technology, Atlanta, GA, USA, where he is also the Director of the Georgia Tech Center of Circuits and Systems (CCS) and the Georgia Tech Electronics and Micro-System (GEMS) Lab. He has authored or coauthored over 190 peer-reviewed journal articles and conference papers. He is interested in innovating analog, mixed-signal, RF, and mm-Wave integrated circuits and hybrid systems for wireless communication, sensing, and bioelectronics applications.

Sorin Voinigescu

Sorin P. Voinigescu (M’90) received the M.Sc. degree in electronics from the Polytechnic Institute of Bucharest, Bucharest, Romania, in 1984, and the Ph.D. degree in electrical and computer engineering from the University of Toronto, Toronto, ON, Canada, in 1994.,In 2002, he joined the Electrical and Computer Engineering Department, University of Toronto, where he is currently the Stanley Ho Chair in microelectronics and the Director of the VLSI Research Group. From 1984 to 1991, he worked in microwave and quantum semiconductor device and circuit research, and as an Assistant Professor in Bucharest. From 1994 to 2002, he was first with Nortel and later with Quake Technologies, Ottawa, ON, Canada. From 2008 to 2009 and from 2015 to 2016, he spent sabbatical leaves at Fujitsu Laboratories of America, Sunnyvale, CA, USA, at NTT’s Device Research Laboratories, Atsugi, Japan, at UNSW, Sydney, NSW, Australia, and at Robert Bosch GmbH, Dresden, Germany, exploring technologies and circuits for 128-Gbd fiber-optic systems, 300-Gb/s mm-wave radio transceivers, imaging, and radar sensors. Dr. Voinigescu co-founded and was the CTO of two fabless semiconductor start-ups: Quake Technologies and Peraso Technologies. He was a member of the International Technology Roadmap for Semiconductors RF/AMS Committee from 2008 to 2015, has served on the TPC and ExCom of the IEEE CSICS from 2003 to 2013, and is a member of the ExCom of the IEEE BCTM. He received the Nortel’s President Award for Innovation in 1996 and was a co-recipient of the Best Paper Award at the 2001 IEEE CICC and the 2005 IEEE CSICS, and the Beatrice Winner Award at the 2008 IEEE ISSCC. His students have won several best student paper awards at the IEEE VLSI Circuits Symposium, IEEE IMS, IEEE RFIC, and IEEE BCTM. In 2013, he was recognized with the ITAC.

Uwe Rueddenklau

Uwe Rüddenklau currently leads Standardization at Infineon Technologies, a top10 semiconductor company, headquartered in Germany.

Uwe is Vice-chair of the new 5G–ACIA (Alliance for Connected Industries and Automation) – Working Group Liaisons & Dissemination, includes members from ICT and OT companies. Companies include international academia, semiconductor companies, and machines builders up to MNOs. This work includes coordination and publication of Whitepaper, Liaisons with other SDOs and standardization bodies like 3GPP, MultiFire, 5G-IA, 5GMF etc.

Additionally Uwe is representative at ETSI and actively work in the Millimeter Wave Transmission Industry Specification Group (ISG mWT). A publication was a White Paper on semiconductors for RF frontends. Uwe participate in the 5G-AA consortium for Infineon in various WGs, looking after 5G RF and related use cases. A major part of his work is also on international standardization organizations like IEC and ISO. In the IEC semiconductor device Technical Committee, Uwe takes co-Convenor of working group for MEMS.

Uwe is specialized in mm Wave RF technologies with a focus in particular on 5G mm Wave radio infrastructure and access, as well as V-band and E-band backhaul radios.

Uwe was responsible for developing Infineon’s 24 to 100 GHz portfolio and for future mm Wave bands above 100GHz with a view to reducing TCO (Total Cost of Ownership) and easing RF design, testing and production.

Uwe has more than 25 years of industry experience and has worked around the world in system engineering, sales and technical marketing of RF solutions for consumer TV, customer premise equipment and mobile phone applications. Prior to Infineon Technologies, Uwe held senior positions with Lantiq and Siemens. Uwe is based in Munich, Germany, and holds a Masters (Dipl.-Ing.) in Electrical Engineering along with a Bachelor in Marketing.

Gabriel Rebeiz

Gabriel M. Rebeiz (S’86–M’88–SM’93–F’97) received the Ph.D. degree from the California Institute of Technology, Pasadena, CA, USA. From 1988 to 2004, he was with the University of Michigan, Ann Arbor, MI, USA. His group has optimized the dielectric-lens antenna which is the most widely used antenna at millimeter-wave and terahertz frequencies. His group also developed 6–18-GHz, 30–35-GHz, 40–50-GHz, 77–86-GHz, and 90–110-GHz 8- and 16-element phased arrays on a single silicon chip, the first silicon phasedarray chip with built-in-self-test capabilities, the first wafer scale phased arrays with on-chip antennas, and the first SiGe millimeter-wave silicon passive imager chip at 85–105 GHz. His group also demonstrated high performance RF MEMS tunable filters at 0.7–6 GHz, RF MEMS phase shifters at 1–100 GHz, and high-power high-reliability RF MEMS metal contact switches. As a consultant, he helped develop 24- and 77-GHz single chip SiGe automotive radars, phased arrays operating at X- to W-band for defense and commercial applications, such as SATCOM, automotive, and point-to-point, digital beamforming systems, and several industrial RF MEMS switches. He is currently a member of the National Academy, a Distinguished Professor and the Wireless Communications Industry Chair Professor in electrical and computer engineering with the University of California at San Diego (UCSD), La Jolla, CA, USA. He has authored or coauthored over 650 IEEE publications, and authored the book RF MEMS: Theory, Design and Technology (Wiley, 2003). He has graduated 64 Ph.D. students and 21 post-doctoral Fellows. He currently leads a group of 18 Ph.D. students and post-doctoral Fellows in the area of millimeter wave radio-frequency integrated circuits (RFICs), tunable microwave circuits, RF MEMS, and planar millimeter-wave antennas and terahertz systems.

Dr. Rebeiz was a recipient of the URSI Koga Gold Medal, the IEEE Microwave Theory and Technique Society (IEEE MTT-S) 2000 and 2014 Microwave Prize, the IEEE MTT-S 2010 Distinguished Educator Award, the IEEE Antennas and Propagation Society (AP-S) 2011 John D. Kraus Antenna Award, the 2012 Intel Semiconductor Technology Council Outstanding Researcher in Microsystems, an R& D100 2014 Award for his work on phased array automotive radars, the 2014 IEEE Daniel E. Noble Field Medal for his work on RF MEMS, and the IEEE AP-S 2015 Harold A. Wheeler Applications Prize Paper Award. He was also a recipient of the 1997–1998 Eta Kappa Nu Professor of the Year Award, the 1998 College of Engineering Teaching Award, and the 1998 Amoco Teaching Award given to the best undergraduate teacher at the University of Michigan, and the 2008 Teacher of the Year Award of the Jacobs School of Engineering, UCSD. He was a National Science Foundation Presidential Young Investigator and the 2003 IEEE MTTS Distinguished Young Engineer. His students have received a total of 22 Best Paper Awards from the IEEE MTT-S, RFICs, and AP-S conferences. He has been an Associate Editor of the IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, and a Distinguished Lecturer of the IEEE MTT-S, the IEEE AP-S, and the IEEE Solid-State Circuits Society.