Heyi Li

Heyi Li received the B.S. degree (with honors) from the College of Physics, Sichuan University, Chengdu, in 2017, and the M.S. degree (with honors) from the School of Integrated Circuits, Peking University, Beijing, in 2020. He is currently pursuing the Ph.D. degree at the School of Integrated Circuits, Peking University, Beijing, China.

 His current research interests include energy-efficient sensor interfaces and innovative analog and mixed-signal circuits. He has first-authored and co-authored several papers in International Solid-State Circuits Conference (ISSCC), Custom Integrated Circuit Conference (CICC) and Journal of Solid-State Circuits (JSSC). He was a recipient of the 2023-2024 IEEE Solid-State Circuits Society (SSCS) Predoctoral Achievement Award and the 2021 ISSCC Demonstration-Session Award.

Yifan He

Yifan He received the B.S. degree from the Department of Electronic Engineering, Tsinghua University, Beijing, China, in 2019. He is now pursing the Ph.D. degree in Tsinghua University under the guidance of Prof. Yongpan Liu. His doctoral research includes emerging non-volatile memories and in-memory computing designs with a focus on digital circuit technology for superior efficiency and compute density. He has first-authored two papers in International Solid-State Circuits Conference (ISSCC) and co-authored several papers in Symposium on VLSI Circuits (VLSI) and Journal of Solid-State Circuits (JSSC), where he also serves as a reviewer.

Tianxiang Qu

Tianxiang Qu (Graduate Student Member, IEEE) received his B.S. and M.S. Degrees in electronic science and technology from Northwestern Polytechnical University, Xi’an, China, in 2017 and 2020, respectively. He is currently pursuing the Ph.D. Degree at Fudan University, Shanghai, China. His research interests include high-precision analog and sensor interfaces.    Mr. Qu serves as a technical reviewer for the IEEE Journal of Solid-State Circuits and is a co-recipient of the ISSCC Silkroad Award in 2022. His works have led to several firstauthored publications at the IEEE Solid-State Circuits Letters (SSC-L), the IEEE Journal of Solid-State Circuits (JSSC), and the IEEE Custom Integrated Circuits Conference (CICC). 

Xinjian Liu

Xinjian Liu received his BEng in Microelectronics from Fudan University, Shanghai, China, in 2019. He joined the University of Virginia (UVa) in July 2019 and is working towards his Ph.D. in Electrical Engineering. His research interests include low-power DC-DC converter, Power Management Unit, and IoT System-on-Chip design.

In the summer of 2022, he was a Silicon Design Intern with Everactive, Charlottesville, VA, USA.

Xinjian was a recipient of the SSCS International Student Circuits Video Contest Award in 2020. His research resulted in first-authored publication in Journal of Solid-State Circuits (JSSC), Symposium on VLSI Circuits (VLSI), European Solid-State Circuits Conference (ESSCIRC), and 3 first-authored publications in IEEE International Solid-State Circuit Conference (ISSCC) consecutively from 2022 to 2024.

Xinling Yue

Xinling Yue joined the Electronic Instrumentation Laboratory at Delft University of Technology in December 2020, Delft, Netherlands, where she is pursuing the Ph.D. degree in Microelectronics. She received her B.S. degree and M.S degree from Qufu Normal University and University of Electronic Science and Technology of China in 2017 and 2020 respectively. Her current research is focused on energy-efficient power management integrated circuits and systems, which include energy harvesting, AC/DC rectifiers, DC/DC converters, and maximum power point tracking techniques. 

Her research has resulted in over ten first-authored publications at the IEEE International Solid-State Circuits Conference (ISSCC), IEEE Journal of SolidState Circuits (JSSC), and IEEE Transactions on Circuits and Systems II (TCASII): Express Briefs etc. She has served as a technical reviewer for the IEEE International Symposium on Circuits and Systems, IEEE Transactions on Circuits and Systems II: Express Briefs, and the IEEE Sensors Journal etc. She received the Best Student Paper Award at 2022 IEEE International Conference on Electronics Circuits and Systems (ICECS), Student Travel Grant Awards in 2022 IEEE International Symposium on Circuits and Systems (ISCAS) and 2023 ISSCC.

Mostafa Essawy

Mostafa Essawy received the B.Sc. (Hons.) and M.Sc. degrees in electrical engineering from Ain Shams University, Cairo, Egypt, in 2014 and 2019. From 2014 to 2019, he was an analog/mixed-signal IC Design Engineer with Si-Ware Systems, Cairo. In 2022, he was an RFIC Design Intern with Apple. Currently, he is pursuing a Ph.D. degree in electrical engineering at Oregon State University, Corvallis, USA. His current research interests include RF and mm-wave circuits and systems in next-generation wireless communications and radar. He was selected for the EECS Outstanding Scholar Program at Oregon State University in 2019, and the Analog Devices Outstanding Student Designer Award in 2022. He has served as a reviewer for IEEE Transactions on Circuits and Systems I: Regular Papers, and for Springer: Circuits, Systems, and Signal Processing (CSSP).

Chengshuo Yu

Chengshuo Yu (Graduate Student Member, IEEE) received the B.S. degree in electronic engineering from Feng Chia University, Taiwan, in 2019. Currently, he is pursuing a Ph.D. in the School of Electrical and Electronic Engineering at Nanyang Technological University, Singapore.

His primary areas of interest encompass mixed-signal SRAM/DRAM-based in-memory computing, time-domain hardware acceleration, and Ising machines for tackling complex combinatorial optimization problems. His commitment and innovative work have led to multiple first-authored publications in prestigious IEEE journals and conferences, including the Journal of Solid-State Circuits (JSSC), Custom Integrated Circuits Conference (CICC), European Solid-State Circuits Conference (ESSCIRC), and Transactions on Circuits and Systems I: Regular Papers (TCAS-I). He serves as a reviewer for IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), IEEE Solid-State Circuits Letters (SSC-L), and IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II).

Yoontae Jung

Yoontae Jung (Graduate Student Member, IEEE) received the B.S. and M.S. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2017 and 2019, respectively, where he is currently pursuing the Ph.D. degree in electrical engineering. His current research interests include the design of low-power low-noise sensor interface integrated circuits, biomedical integrated circuits, neural interface systems, and power-efficient high-resolution data converters.

His Ph.D. research resulted in several publications in IEEE Journal of Solid-State Circuits (JSSC), Symposium on VLSI Technology and Circuits (SOVC), Custom Integrated Circuits Conference (CICC), Asian Solid-State Circuits Conference (A-SSCC), Solid-State Circuits Letters (SSC-L), Transactions on Biomedical Circuits and Systems (TBioCAS), Transactions on Circuits and Systems II: Express Briefs (TCAS-II) and etc. Mr. Jung also served as a reviewer for the IEEE JSSC, TCAS-I, TCAS-II, and Open Journal of Circuits and Systems (OJCAS). He was a recipient of IEEE Circuit and System Society (CASS) Student Travel Grant Award (2023).

Tingxu Hu

Tingxu Hu received the B.E. degree from the South China University of Technology, Guangzhou, China, in 2019. He is currently pursuing the Ph.D. degree with the State Key Laboratory of Analog and Mixed-Signal VLSI, University of Macau, Macao, China. His research interests include RF energy harvesting, hybrid DC-DC converter and isolated power converter. His research has resulted in first-authored IEEE publications in Transactions on Power Electronics (TPEL), Transactions on Circuits and Systems I (TCAS-I), Journal of Solid-State Circuits (JSSC) and International Solid-State Circuits Conference (ISSCC).

Yongjae Park

Yongjae Park (S’18) received the B.S. (Summa cum laude) degree in electrical engineering from Ulsan National Institute of Science and Technology (UNIST), Ulsan, South Korea, in 2018, where he is currently pursuing the combined M.S and Ph.D degree. He was a visiting scholar in University of California San Diego, San Diego, CA, USA from Aug 2022 to Jul 2023. His current research interests include CMOS analog/mixed IC designs, especially low noise sensor front-end for bio-potential recording system and imaging system.  He has authored and co-authored in several publications in IEEE International Solid-State Circuits Conference (ISSCC), IEEE Symposium on VLSI Circuit (VLSI), IEEE Asian SolidState Circuit Conference (A-SSCC), IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), and IEEE Solid-State Circuits Letters (SSC-L). He has served as a reviewer for the IEEE JSSC, IEEE TBioCAS, IEEE Transactions on Circuit and System Ⅱ: Express Briefs (TCAS-Ⅱ) and IEEE International Symposium on Circuit and System (ISCAS). 

Kyeongho Eom

Kyeongho Eom (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from Korea University, Seoul, South Korea, in 2020, where he is currently pursuing the M.S. and Ph.D. joint degree.

His current research interest includes analog/mixed-signal IC designs for neural interfaces and retinal prostheses. His work so far resulted in first/co-authored conference papers at International Solid-State Circuits Conference (ISSCC), Symposium on VLSI Circuits (VLSI), Custom Integrated Circuits Conference (CICC), and European Solid-State Circuits Conference (ESSCIRC) and journal papers in Journal of Solid-State Circuits (JSSC), Transactions on Power Electronics (TPEL), and Transactions on Circuits and Systems I (TCAS-I).

Mr. Eom was a recipient of the Presidential Award (1st) in the 24th Korea Semiconductor Design Competition in 2023, and a co-recipient of the Outstanding Student Paper Award from IEEE Custom Integrated Circuits Conference (CICC) in 2023.

He is a member of both IEEE and the Solid-State Circuits Society (SSCS). He has completed his Ph.D. coursework and is currently in his 4th year of a joint M.S./Ph.D. program in Electrical Engineering.

Juzheng Liu

Juzheng Liu (Graduate Student Member, IEEE) received his B.S. degree in physics from Tsinghua University, Beijing, China, in 2019. He is currently pursuing his Ph.D. degree with the University of Southern California, Los Angeles, CA, USA. He was a Ph.D. intern in MediaTek from 2022 Q1 to 2023 Q3. His research interests include high-speed data converter design, machine-learning-based circuit modeling, and circuit design automation. Juzheng Liu was a recipient of the ISSCC 2022 Jack Kilby Award for Outstanding Student Paper. He is a USC Ming Hsieh Institute Scholar from 2023 to 2024. Juzheng has served as the technical reviewer of the IEEE Journal of Solid-State Circuits, IEEE Solid-State Circuits Letters, and IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.

Chanwoong Hwang

Chanwoong Hwang (Graduate Student Member, IEEE) was born in Ulsan, South Korea, in 1994. He received the B.S. degree (summa cum laude) in electrical engineering from the Ulsan National Institute of Science and Technology (UNIST), Ulsan, South Korea, in 2019. He is currently pursuing the M.S/Ph.D. degree with the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea. His research interests include CMOS analog/mixed integrated circuit (IC) designs, especially high-speed clock/frequency generation systems. He received two Silver Prizes (2021 and 2020) in the Samsung Human-Tech Paper Award in Circuit Design hosted by Samsung Electronics.

Kiseo Kang

Kiseo Kang (Graduate Student Member, IEEE) received the B.S. and M.S. degrees from the Pohang University of Science and Technology (POSTECH), Pohang, South Korea, in 2018 and 2020, respectively, where he is currently pursuing the Ph.D. degree all in electronic and electrical engineering. Also, he is currently a student researcher at Google Quantum AI (Goleta, CA). His research interests include mixed-signal circuits and cryo-CMOS circuits for quantum computing.

He has been awarded the Global Ph.D. scholarship by the Korean government from 2019 to 2023. His Ph.D. research resulted in several first-authored IEEE publications in the Symposium on VLSI Circuits (VLSI) in 2021, International Solid-State Circuits Conference (ISSCC) in 2022, IEEE Journal of Solid-State Circuits (JSSC) in 2022 and ISSCC in 2023.

Xiaohan Zhang

Xiaohan Zhang (Graduate Student Member, IEEE) received the B.S. degree from Tsinghua University, Beijing, China in 2019, and is currently working toward the Ph.D. degree in electrical and computer engineering from Rice University, Houston, TX, USA. His current research focuses on millimeter-wave/THz integrated circuits and systems for wireless communications. From August 2021 to May 2022, he was an internship student at Samsung Research America (SRA), working on THz IC design. He received the ISSCC travel grant award in 2023, the IEEE RFIC Symposium Best Student Paper Award Finalist in 2022 and the IEEE Custom Integrated Circuits Conference (CICC) Best Student Paper Award in 2021. He was also a co-recipient of IEEE RFIC Symposium Best Industry Paper Award Finalist in 2023. He has served as a reviewer of the IEEE JSSC, TCAS-I, and TCAS-II.

Ahmed Abdelrahman

Ahmed Abdelrahman (Graduate Student Member, IEEE) received the B.Sc. and M.Sc. degrees in electrical engineering from Ain Shams University, Cairo, Egypt, in 2011 and 2017, respectively. He is currently pursuing the Ph.D. degree in electrical engineering at the University of Illinois Urbana-Champaign, Champaign, IL, USA, where he conducts research on low-power wireline optical receivers for short-reach applications. In summer 2021, he was a Hardware Intern in Optical Systems & Interconnects group, Cisco Systems, PA, USA, where he worked on high-performance Coherent/IMDD optical transceivers. From 2011 to 2019, he was a Staff Analog/RF Design Engineer at Si-Ware Systems, Cairo, Egypt, designing self-compensated LC reference oscillators and wireless power delivery transceivers. His research interests include energy-efficient wireline transceivers, high-performance PLLs, temperature- and aging-compensated oscillators and RF integrated circuits. He holds one U.S. patent, and his research resulted in several publications in IEEE Journal of Solid-State Circuit (JSSC), International Solid-State Circuits Conference (ISSCC), Custom Integrated Circuits Conference (CICC) and Symposium on VLSI Technology & Circuits (VLSI). Mr. Abdelrahman is a two-year recipient of Andrew T. Yang Research and Entrepreneurship Award from the University of Illinois for the period 2020–2022.

Yijie Wei

Yijie Wei received the B.E. degree in Electrical Engineering(cum laude) from University of Mississippi, Oxford, USA and North China University of Technology, Beijing, China respectively in 2017, and the M.S. degree in Computer Engineering from Northwestern University, Evanston, USA in 2019. He is currently pursuing Ph.D. degree at Northwestern University. His main research interests are in biosignals AI classification SoC, body area system, low power mixed signal circuits design. His previous works has been accepted by IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), IEEE Journal of Solid-State Circuits(JSSC), IEEE Custom Integrated Circuits Conference (CICC), IEEE Engineering in Medicine & Biology Society (EMBC) and IEEE Design Automation Conference (DAC) respectively. He also serves as a reviewer of IEEE Engineering in Medicine & Biology Society.

Yuhao Ju

Yuhao Ju received the B.S. degree in Integrated Circuits Design and Integrated System from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2017, and the M.S. degree in Electrical Engineering from Northwestern University, Evanston, IL, USA, in 2019. He is currently pursuing the Ph.D. degree in computer engineering at the VLSI lab from Northwestern University. His current research interests include efficient architecture design for AI/ML accelerator and SoC, AI/ML related optimization for computer architecture and parallel computing, high performance scientific computing acceleration. His work is accepted for the best poster award in the 3rd IBM IEEE CAS/EDS AI Compute Symposium. He is the first author and co-author for several publications based on his research in IEEE International Solid-State Circuits Conference (ISSCC), IEEE Symposium on VLSI Technology and Circuits (VLSI), European Solid-State Device Research Conference (ESSCIRC), IEEE/ACM International Symposium on Microarchitecture (MICRO), IEEE Journal of Solid-State Circuits (JSSC), etc. He also serves as a reviewer for IEEE Journal of Solid-State Circuits (JSSC) and IEEE Transactions on Very Large Scale Integration (TVLSI).

Jooeun Bang

Jooeun Bang (Graduate Student Member, IEEE) was born in Busan, South Korea, in 1995. She received the B.S. and M.S. degrees in electrical engineering from the Ulsan National Institute of Science and Technology (UNIST), Ulsan, Korea, in 2018 and 2020, respectively. She is currently pursuing a Ph.D. degree with the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea. Her research interests include RF and analog/mixed-signal IC designs, especially low-jitter low-power clock generation circuits for beyond 5G wireless and high-speed wireline systems and fast-transient-response low-power digital low-dropout regulators. Ms. Bang received the Presidential Award and the Corporate Special Award at the 22nd and 21st Korea Semiconductor Design Competition in 2021 and 2020, respectively.

Bowen Wang

Bowen Wang (Graduate Student Member, IEEE) received the B.S. degree in integrated circuit design and integrated systems, from Xidian University, Xi’an, Shaanxi, China, in 2018. He is currently pursuing the Ph.D. degree under the supervision of Prof. Woogeun Rhee with the School of Integrated Circuits, Tsinghua University. His research interests include mixed-signal and RF circuit design for low-power, short-range communications. He has first-authored and co-authored more than 10 papers, including IEEE International Solid-State Circuits Conference (ISSCC), Custom Integrated Circuit Conference (CICC), Radio Frequency Integrated Circuits Symposium (RFIC), and Journal of Solid-State Circuits (JSSC).

Soroush Araei

Soroush Araei (Graduate Student Member, IEEE) received the B.S. and M.S. degrees in electrical engineering from the Sharif University of Technology, Tehran, Iran, in 2016 and 2018, respectively. He is currently pursuing the Ph.D. degree with the Department of Electrical Engineering and Computer Science at MIT, Cambridge, MA, USA. During the summers of 2022 and 2023, he was an Intern with Apple Inc.’s analog-mixed signal team, Cambridge, MA. His research interests include RF and mm-wave circuits for wireless communication applications. Mr. Araei was a recipient of Custom Integrated Circuits Conference (CICC) 2020 Student Education Grant Award and the 2023 Analog Devices Outstanding Student Designer Award.

Yihong Zhu

Yihong Zhu received his B.E. degree from University of Electronic Science and Technology of China (UESTC), Chengdu, China in 2018. He is currently working toward the Ph.D. degree in electronic science and technology with the School of Integrated Circuits, Tsinghua University, Beijing, China.   His research interests include reconfigurable cryptographic accelerator design, particularly agile post quantum chip implementation, as well as domain specific architecture and the efficient mapping of algorithms. He has first-authored several papers in International Solid-State Circuits Conference (ISSCC), IEEE Journal of Solid-State Circuits(JSSC), IEEE Transactions on Circuits and Systems I (TCAS-1), and IEEE/ACM Design Automation Conference (DAC), etc.   Mr. Zhu received the National Scholarship for Doctoral Students in 2022, Tsinghua University Scholarship for Future Scholars in 2018, Outstanding Undergraduate Graduates in 2018, and the first prize of Chinese National Mathematical Competition in 2015. 

Sidharth Thomas

Sidharth Thomas received the B.Tech. degree in electronics and communication engineering from Indian Institute of Technology Roorkee, India, in 2020, and the M.Sc. degree in electrical and computer engineering from the University of California at Los Angeles, Los Angeles, CA, USA, in 2022, where he is currently pursuing the Ph.D. degree. He was an RF/mm-Wave design intern at Texas Instruments, Dallas in Summer 2023, where he worked on mm-Wave IC design. Prior to this, he interned at the Technion–Israel Institute of Technology, Haifa, Israel, and the University of Toronto, Toronto, ON, Canada, in 2018 and 2019. 

His research interests include high-frequency integrated circuit design for wireless communication, imaging, and sensing applications. His research has resulted in various publications in the IEEE Journal of Solid-State Circuits (JSSC), Radio Frequency Integrated Circuits Symposium (RFIC), Custom Integrated Circuits Conference (CICC) etc. Mr. Thomas received the IIT Roorkee ECE Department Gold Medal in 2020, the UCLA Guru Krupa Fellowship in 2020, the IEEE MTT-S Pre-Graduate/Graduate Fellowship in 2022, the 2023 IEEE ISSCC Student Travel Grant Award, and was a presenter at the 2023 ISSCC Student Research Preview.

Tuur Van Daele

Tuur was born in Belgium in 1995.

In 2013, he started studying engineering at KU Leuven. He was honored with the Best Student Award from the Faculty of Engineering Science in 2014. Beyond his academic pursuits, he continued his boundless curiosity for electronics through various extracurricular activities. He has successfully designed a PCB datalogger to monitor a solar panel installation in DR Congo, which he installed on-site. Additionally, he taught electronics at the Children's University and followed a two-week telecommunication training during his summer break.

In 2018, he obtained his M. Sc. Degree in Electrical Engineering, magna cum laude (83 %), from KU Leuven. His master's thesis paper was published at the International Conference on Ph.D. Research in Microelectronics and Electronics, where he received the Bronze Leaf Award. During his education, he pursued three additional international courses at the Polytechnic University of Madrid, the University of Podgorica, and the University of Patras. He also completed a voluntary internship at the company Melexis, where he designed a Digital-to-Analog Converter (DAC).

In October 2018, he started his Ph.D. at the KU Leuven ESAT-MICAS Research group, focusing on fully integrated high-voltage DC-DC and AC-DC conversion. One month later, he successfully presented his research proposal before an expert panel of Flanders Innovation and Entrepreneurship, resulting in the Baekeland grant to fund his research. During his Ph.D., he co-founded the SSCS Student Chapter Leuven, which organizes inspiring lectures and symposia about microelectronics.

Tuur is the first author of four publications, with one more already accepted and an additional JSSC invite currently in submission. His most recent conference papers were published at the 2023 VLSI Symposium and the 2022 CICC conference, which were both invited for a JSSC extension based on the quality of the work. His VLSI paper ranked among the highest at the conference, granting him an exclusive invitation to the IBM luncheon. He received the 2022 Golden Award in the Huawei Ph.D. Student Contest and two SSCS travel grants in 2022 and 2023.

Yipeng Wang

Yipeng Wang is a Ph.D. student in Electrical and Computer Engineering at the University of Texas at Austin. He completed his bachelor degree with outstanding honor from Beihang University (Bejing Univ of A. & A.). He was a research assistant in Tsinghua University 2020, where he worked on ML accelerators, SRAM in-memory computing and RISCV SoCs with NICS group. He was ASIC intern in Apple 2022 and 2023 summer. His current research interests are Compute-in-memory systems, RISC-V CPU/GPU, and architecture based on novel technology/device. Yipeng serves as reviewer for TCAS-I, TCAS-II, TVLSI, DAC, JETCAS, and TETC.

Rozhan Rabbani

Rozhan Rabbani received the B.Sc. degree from Sharif University of Technology, Tehran, Iran, in 2018. She is currently pursuing the Ph.D. degree with the Department of Electrical Engineering and Computer Sciences, University of California Berkeley, Berkeley, CA, USA. She received her Master’s degree in 2023 and is expecting to graduate in May 2024. At Sharif University of Technology, she worked on analog and mixed-signal circuits to minimize power consumption of wearable ECG sensors. Her research at UC Berkeley is focused on developing biosensing, energy harvesting and low-power sensors, specifically implantable image sensors for cancer therapy. Her work has led to one pending US patent, been accepted to ISSCC24 and published at CICC, EMBC, IEEE Sensors Journal, etc. She interned at Apple Inc. during Summers 2020 and 2022 working on electrical modeling for optical components in the Camera Hardware group and built-in self-test circuits for high-speed applications as a part of the High-Speed Converters team. She was the recipient of the Grace Hopper scholarship in 2021 and the Apple Ph.D. Fellowship in Integrated Circuits in 2022. Rozhan has served as a technical reviewer of the IEEE Journal of Solid-State Circuits.