SSC-L Editorial Board

EDITOR-IN-CHIEF

Pui-In Mak

State-Key Laboratory of Analog and Mixed-Signal VLSI,

Institute of Microelectronics, University of Macau,

Avenida da Universidade, Taipa, Macau, China

ASSOCIATE EDITORS

Mark Oude Alink m.s.oudealink@utwente.nl University of Twente, Department of EEMCS,Integrated Circuit Design The Netherlands	Hong Zhang hongzhang@xjtu.edu.cn Xi'an Jiaotong University Xi'an, China	Priyanka Raina praina@standford.edu Standorford Univeristy, Electrical Engineering, Integrated Circuit Design USA
Wei Deng wdeng@tsinghua.edu.cn Tsinghua University Beijing, China	Yunzhi (Rocky)Dong yunzhi.dong@ieee.org MediaTek Inc. Woburn, MA, USA	John Wuu john.wuu@amd.com Advanced Micro Devices Fort Collins, CO
Shahriar Shahramian Shahriar.Shahramian@Nokia-Bell-Labs.com Bell Labs – Nokia New Providence, NJ, USA	Yohan Frans yohan@xilinx.com Xilinx San Jose, California, USA	Li Geng gengli@xjtu.edu.cn Xi’an Jiaotong University Xi’an, China
Ulkuhan Guler uguler@wpi.edu Worcester Polytechnic Institute Worcester, MA, USA	Drew Hall DrewHall@ucsd.edu University of California San Diego La Jolla, CA, USA	Amr Fahim amfahim@ieee.org Broadcom, Inc. California, USA
Masum Hossain masum@ualberta.ca University of Alberta Edmonton Alberta	Ping-Hsuan Hsieh phsieh@ee.nthu.edu.tw National Tsing Hua University Hsinchu City, Taiwan	Nader Kalantari nader@arianrf.com ArianRF / Broadcom Ltd California, USA
Abishek Manian a-manian@ti.com Texas Instruments Santa Clara, California, USA	Dr. Farhana Sheikh farhana.sheikh@intel.com Intel Corporation MS: JF2-82 Hillsboro, Oregon USA	Antonio Liscidini University of Toronto antonio.liscidini@utoronto.ca Toronto, Canada
Samuel Palermo spalermo@tamu.edu Texas A & M University College Station, Texas, USA	Mingoo Seok mgseok@ee.columbia.edu Columbia University New York, NY, USA	Ken Takeuchi takeuchi@takeuchi-lab.org University of Tokyo Tokyo, Japan
Xin Zhang xzhang@us.ibm.com IBM T.J. Watson Research center Yorktown Heights, NY, USA	Jongsun Park jongsun@korea.ac.kr Korea University Seoul, Korea	Shiuh-hua Wood Chiang wochiang@byu.edu Brigham Young University Provo, Utah, USA
Shiheng Yang ysh@uestc.edu.cn University of Electronic Science and Technology of China China	Ka-Fai Un kafaiun@um.edu.mo University of Macau Macao, China	Danilo Manstretta danilo.manstretta@unipv.it University of Pavia Pavia, Italy
Saurabh Saxena saurabh.saxena@ee.iitm.ac.in Indian Institute of Technology Madras, India	Xiyuan Tang xitang@pku.edu.cn Peking University Beijing, China	Hanh-Phuc Le hanhphuc@ucsd.edu University of California San Diego, USA
Sameh Ibrahim sameh.ibrahim@eng.asu.edu.eg Ain Shams University Cairo, Egypt	Masoud Babaie m.babaie@tudelft.nl Delft University of Technology The Netherlands	Bongjin Kim bongjin@ucsb.edu University of California Santa Barbara, California, USA
Jun-Chau Chien jcchien@berkeley.edu University of California Berkeley, USA	Joseph Shor joseph.shor@biu.ac.il Bar Ilan University – Faculty of Engineering Israel